Inventor

VISWANATHAN LAKSHMINARAYAN

US92 patents

⚠️ This page may combine multiple inventors who share the name “VISWANATHAN LAKSHMINARAYAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VISWANATHAN LAKSHMINARAYAN

NXP USA INC

Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

Microelectronic modules including thermal extension levels and methods for the fabrication thereof

Electromagnetically-shielded microelectronic assemblies and methods for the fabrication thereof

Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof

Semiconductor devices with protruding conductive vias and methods of making such devices

Power amplifier modules including topside cooling interfaces and methods for the fabrication thereof

Hybrid device assemblies and method of fabrication

Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

Power amplifier packages and systems incorporating design-flexible package platforms

Internally-shielded microelectronic packages and methods for the fabrication thereof

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Methods of manufacturing packaged electronic devices with top terminations

Leadless power amplifier packages including topside terminations and methods for the fabrication thereof

Microelectronic components having integrated heat dissipation posts and systems including the same

Method of wafer dicing for wafers with backside metallization and packaged dies

Packaged microelectronic component mounting using sinter attachment

Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof

Packaged electronic devices with top terminations

FREESCALE SEMICONDUCTOR INC

Method of packaging a semiconductor die and package thereof

Semiconductor structure and method of assembly

Semiconductor structure and method of manufacture

Packaged electronic devices with top terminations, and methods of manufacture thereof

Air cavity packages and methods for the production thereof

Semiconductor device packages

Flexible circuit leads in packaging for radio frequency devices

Semiconductor device package and methods of manufacture thereof

Semiconductor devices with impedance matching-circuits

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

Semiconductor package design providing reduced electromagnetic coupling between circuit components

VISWANATHAN LAKSHMINARAYAN

Semiconductor devices with a thermally conductive layer and methods of their fabrication

Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process

High power semiconductor package subsystems

Packaged semiconductor devices and methods of their fabrication

System, method and apparatus for leadless surface mounted semiconductor package

Electronic devices with semiconductor die coupled to a thermally conductive substrate

Solder wettable flanges and devices and systems incorporating solder wettable flanges

Semiconductor devices with impedance matching-circuits

MOTOROLA INC

Semiconductor component and method for manufacturing the semiconductor component

Semiconductor package

Semiconductor component

Wire bond-less electronic component for use with an external circuit and method of manufacture

Method of manufacturing a wire bond-less electronic component for use with an external circuit

SANCHEZ AUDEL A

Packaged leadless semiconductor device