Inventor

BALL MICHAEL B

US123 patents

⚠️ This page may combine multiple inventors who share the name “BALL MICHAEL B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BALL MICHAEL B

MICRON TECHNOLOGY INC

Method of fabrication of stacked semiconductor devices

Method of fabrication of stacked semiconductor devices

Multi-chip device utilizing a flip chip and wire bond assembly

Method of fabrication of stacked semiconductor devices

Die interconnections using intermediate connection elements secured to the die face

Combination of semiconductor interconnect

Angularly offset stacked die multichip device and method of manufacture

Multi-chip stacked devices

Stacked semiconductor devices

Combination of semiconductor interconnect

Angularly offset stacked die multichip device and method of manufacture

Multi-chip device and method of fabrication employing leads over and under processes

Angularly offset and recessed stacked die multichip device and method of manufacture

Wafer handling device having conforming perimeter seal

Angularly offset stacked die multichip device and method of manufacture

Angularly offset and recessed stacked die multichip device

Angularly offset stacked die multichip device and method of manufacture

Bondhead lead clamp apparatus and method

Method of fabricating a multi-die semiconductor package assembly

Method of disposing conductive bumps onto a semiconductor device

Method for routing die interconnections using intermediate connection elements secured to the die face

Apparatus and methods of automated wafer-grinding using grinding surface position monitoring

Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

Method of improving interconnect of semiconductor devices by using a flattened ball bond

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus for electrically coupling bond pads of a microelectronic device

Method of improving interconnect of semiconductor devices by using a flattened ball bond

Device and method for clamping and wire-bonding the leads of a lead frame one set at a time

Lead penetrating clamping system

Bondhead lead clamp apparatus and method

Method of improving interconnect of semiconductor device by utilizing a flattened ball bond

Lead finger clamp assembly

Multi-chip device and method of fabrication employing leads over and under processes

Apparatus and method of clamping semiconductor devices using sliding finger supports

Method and apparatus for grinding wafers

Method and apparatus for grinding wafers

Use of conductive lines on the back side of wafers and dice for semiconductor interconnects

Conductive lines on the back side of wafers and dice for semiconductor interconnects

Lead penetrating clamping system

Packaging die preparation

Method for conserving a resource by flow interruption

Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond

In-process device with grooved coating layer on a semiconductor wafer for relieving surface tension

Apparatus and methods for coupling conductive leads of semiconductor assemblies

Method of relieving surface tension on a semiconductor wafer

Apparatus and methods for coupling conductive leads of semiconductor assemblies

Method of fabrication of stacked semiconductor devices

Device and method for clamping and wire-bonding the leads of a lead frame one set at a time

MICRON SEMICONDUCTOR INC

Multichip module having a stacked chip arrangement

Multi-chip stacked devices