Inventor

GURRUM SIVA PRAKASH

US19 patents

⚠️ This page may combine multiple inventors who share the name “GURRUM SIVA PRAKASH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GURRUM SIVA PRAKASH

TEXAS INSTRUMENTS INC

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Stud bumps as local heat sinks during transient power operations

IC having a metal ring thereon for stress reduction

Packaged multichip module with conductive connectors

Semiconductor package with filler particles in a mold compound

Wire bond damage detector including a detection bond pad over a first and a second connected structures

IC having a metal ring thereon for stress reduction

Semiconductor package with a wire bond mesh

Wire bond damage detector including a detection bond pad over a first and a second connected structures

Packaged multichip module with conductive connectors

Semiconductor package with filler particles in a mold compound

Semiconductor package with a wire bond mesh

Patterned die pad for packaged vertical semiconductor devices

Integrated circuit package having enhanced thermal dissipation structure

On-time based peak current density rule and design method

LAMSON MICHAEL ANTHONY

Coaxial four-point probe for low resistance measurements

Coaxial four-point probe for low resistance measurements

GURRUM SIVA PRAKASH

Thermal interface material design for enhanced thermal performance and improved package structural integrity

EDWARDS DARVIN R

Semiconductor device having agglomerate terminals