Inventor · disambiguated record
Changhan Hobie Yun
Also filed as: YUN CHANGHAN · YUN CHANGHAN HOBIE
127 granted patents·54 pending applications·600 citations·filing 2005–2025
99Inventor score
Files withQUALCOMM INC145ZUO CHENGJIE11QUALCOMM MEMS TECHNOLOGIES INC6LO CHI SHUN5ANALOG DEVICES INC3
Top patents by PatentIndex Score
181 records- 0198US9449753B2Varying thickness inductorQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·33 cites·25 claims
- 0298US8816567B2Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppressionZUO CHENGJIE·Filed 2011·Granted Aug 26, 2014·200 cites·24 claims
- 0397US9807882B1Density-optimized module-level inductor ground structureQUALCOMM INC·Filed 2016·Granted Oct 31, 2017·21 cites·20 claims
- 0496US9502586B1Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2015·Granted Nov 22, 2016·13 cites·18 claims
- 0595US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 0694US10433425B1Three-dimensional high quality passive structure with conductive pillar technologyQUALCOMM INC·Filed 2018·Granted Oct 1, 2019·10 cites·16 claims
- 0794US10283257B2Skewed co-spiral inductor structureQUALCOMM INC·Filed 2016·Granted May 7, 2019·12 cites·25 claims
- 0894US10242957B2Compartment shielding in flip-chip (FC) moduleQUALCOMM INC·Filed 2015·Granted Mar 26, 2019·13 cites·30 claims
- 0994US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 1094US8803648B2Three-dimensional multilayer solenoid transformerLO CHI SHUN·Filed 2012·Granted Aug 12, 2014·16 cites·9 claims
- 1193US9721946B2Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2016·Granted Aug 1, 2017·7 cites·10 claims
- 1293US9620463B2Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)QUALCOMM INC·Filed 2015·Granted Apr 11, 2017·10 cites·29 claims
- 1393US9101068B2Two-stage power delivery architectureQUALCOMM INC·Filed 2013·Granted Aug 4, 2015·14 cites·8 claims
- 1492US10325855B2Backside drill embedded die substrateQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·10 cites·28 claims
- 1592US9001031B2Complex passive design with special via implementationLO CHI SHUN·Filed 2012·Granted Apr 7, 2015·17 cites·34 claims
- 1691US10292269B1Inductor with metal-insulator-metal (MIM) capacitorQUALCOMM INC·Filed 2018·Granted May 14, 2019·9 cites·20 claims
- 1790US9673275B2Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuitsQUALCOMM INC·Filed 2015·Granted Jun 6, 2017·6 cites·18 claims
- 1889US11515247B2Capacitance fine tuning by fin capacitor designQUALCOMM INC·Filed 2021·Granted Nov 29, 2022·2 cites·20 claims
- 1989US9370103B2Low package parasitic inductance using a thru-substrate interposerQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·9 cites·11 claims
- 2088US9363902B2Three-dimensional multilayer solenoid transformerQUALCOMM MEMS TECHNOLOGIES INC·Filed 2014·Granted Jun 7, 2016·6 cites·7 claims
- 2187US12341488B2Package comprising an acoustic device and a polymer cap layerQUALCOMM INC·Filed 2022·Granted Jun 24, 2025·2 cites·30 claims
- 2287US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 2387US9425761B2High pass filters and low pass filters using through glass via technologyQUALCOMM INC·Filed 2013·Granted Aug 23, 2016·9 cites·21 claims
- 2487US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 2586US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 2686US10049815B2Nested through glass via transformerQUALCOMM INC·Filed 2016·Granted Aug 14, 2018·2 cites·21 claims
- 2786US8987872B2Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packagesQUALCOMM INC·Filed 2013·Granted Mar 24, 2015·8 cites·26 claims
- 2885US9954267B2Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filterQUALCOMM INC·Filed 2016·Granted Apr 24, 2018·4 cites·25 claims
- 2985US9337799B2Selective tuning of acoustic devicesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Granted May 10, 2016·8 cites·14 claims
- 3084US9875848B2MIM capacitor and method of making the sameQUALCOMM INC·Filed 2015·Granted Jan 23, 2018·4 cites·30 claims
- 3184US9099986B2Cross-sectional dilation mode resonatorsZUO CHENGJIE·Filed 2011·Granted Aug 4, 2015·7 cites·32 claims
- 3284US7608534B2Interconnection of through-wafer vias using bridge structuresANALOG DEVICES INC·Filed 2005·Granted Oct 27, 2009·13 cites·20 claims
- 3383US10582609B2Integration of through glass via (TGV) filter and acoustic filterQUALCOMM INC·Filed 2017·Granted Mar 3, 2020·4 cites·19 claims
- 3483US10163771B2Interposer device including at least one transistor and at least one through-substrate viaQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·4 cites·22 claims
- 3583US9813043B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·3 cites·23 claims
- 3683US9768109B2Integrated circuits (ICS) on a glass substrateQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·3 cites·20 claims
- 3783US9368564B23D pillar inductorQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·5 cites·23 claims
- 3883US9355967B2Stress compensation patterningQUALCOMM INC·Filed 2013·Granted May 31, 2016·5 cites·31 claims
- 3983US9275786B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2014·Granted Mar 1, 2016·5 cites·23 claims
- 4082US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 4182US9275876B2Stiffener with embedded passive componentsQUALCOMM INC·Filed 2013·Granted Mar 1, 2016·5 cites·22 claims
- 4281US10103135B2Backside ground plane for integrated circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·3 cites·19 claims
- 4380US10490621B1Close proximity tunable inductive elementsQUALCOMM INC·Filed 2018·Granted Nov 26, 2019·3 cites·10 claims
- 4480US9660110B2Varactor device with backside contactQUALCOMM INC·Filed 2014·Granted May 23, 2017·3 cites·30 claims
- 4578US9130505B2Multi-frequency reconfigurable voltage controlled oscillator (VCO) and method of providing sameZUO CHENGJIE·Filed 2011·Granted Sep 8, 2015·4 cites·32 claims
- 4677US11770115B2Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2021·Granted Sep 26, 2023·1 cites·18 claims
- 4777US11658403B2Device, package and/or substrate comprising curved antennaQUALCOMM INC·Filed 2020·Granted May 23, 2023·1 cites·37 claims
- 4877US10044390B2Glass substrate including passive-on-glass device and semiconductor dieQUALCOMM INC·Filed 2016·Granted Aug 7, 2018·2 cites·17 claims
- 4977US2025219618A1Wideband filter with resonators and inductorsQUALCOMM INC·Filed 2025·Application pending·0 cites
- 5076US9930783B2Passive device assembly for accurate ground plane controlQUALCOMM INC·Filed 2016·Granted Mar 27, 2018·2 cites·37 claims
Showing the top 50 of 181 patent records by PatentIndex Score.
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