Inventor · disambiguated record
Terry A. Spooner
Also filed as: SPOONER TERRY · SPOONER TERRY A · SPOONER TERRY ALLEN
90 granted patents·10 pending applications·585 citations·filing 2002–2021
99Inventor score
Top patents by PatentIndex Score
100 records- 0197US9786603B1Surface nitridation in metal interconnectsIBM·Filed 2016·Granted Oct 10, 2017·14 cites·13 claims
- 0297US7528066B2Structure and method for metal integrationIBM·Filed 2006·Granted May 5, 2009·50 cites·14 claims
- 0396US9373582B1Self aligned via in integrated circuitIBM·Filed 2015·Granted Jun 21, 2016·18 cites·8 claims
- 0496US8288268B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2010·Granted Oct 16, 2012·24 cites·20 claims
- 0595US10192780B1Self-aligned multiple patterning processes using bi-layer mandrels and cuts formed with block masksGLOBALFOUNDRIES INC·Filed 2018·Granted Jan 29, 2019·15 cites·20 claims
- 0694US10157789B2Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2016·Granted Dec 18, 2018·12 cites·11 claims
- 0794US9385078B1Self aligned via in integrated circuitIBM·Filed 2016·Granted Jul 5, 2016·11 cites·1 claims
- 0894US8664766B2Interconnect structure containing non-damaged dielectric and a via gouging featureYANG CHIH-CHAO·Filed 2009·Granted Mar 4, 2014·23 cites·18 claims
- 0993US9548243B1Self aligned via and pillar cut for at least a self aligned double pitchIBM·Filed 2015·Granted Jan 17, 2017·7 cites·16 claims
- 1093US9490168B1Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2015·Granted Nov 8, 2016·10 cites·9 claims
- 1193US9105693B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2012·Granted Aug 11, 2015·11 cites·8 claims
- 1292US9786550B2Low resistance metal contacts to interconnectsIBM·Filed 2015·Granted Oct 10, 2017·8 cites·11 claims
- 1391US9899317B1Nitridization for semiconductor structuresIBM·Filed 2016·Granted Feb 20, 2018·8 cites·18 claims
- 1491US9837309B2Semiconductor via structure with lower electrical resistanceIBM·Filed 2015·Granted Dec 5, 2017·6 cites·3 claims
- 1590US11062993B2Contacts having a geometry to reduce resistanceIBM·Filed 2020·Granted Jul 13, 2021·2 cites·20 claims
- 1690US7709344B2Integrated circuit fabrication process using gas cluster ion beam etchingIBM·Filed 2005·Granted May 4, 2010·16 cites·15 claims
- 1789US8470706B2Methods to mitigate plasma damage in organosilicate dielectricsARNOLD JOHN C·Filed 2012·Granted Jun 25, 2013·8 cites·15 claims
- 1888US7749892B2Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devicesIBM·Filed 2006·Granted Jul 6, 2010·16 cites·3 claims
- 1988US6917108B2Reliable low-k interconnect structure with hybrid dielectricIBM·Filed 2002·Granted Jul 12, 2005·49 cites·32 claims
- 2087US9391020B2Interconnect structure having large self-aligned viasST MICROELECTRONICS INC·Filed 2014·Granted Jul 12, 2016·7 cites·18 claims
- 2187US7750479B2Treatment of plasma damaged layer for critical dimension retention, pore sealing and repairIBM·Filed 2007·Granted Jul 6, 2010·11 cites·19 claims
- 2287US6784105B1Simultaneous native oxide removal and metal neutral deposition methodINFINEON TECHNOLOGIES CORP·Filed 2003·Granted Aug 31, 2004·45 cites·16 claims
- 2385US9466563B2Interconnect structure for an integrated circuit and method of fabricating an interconnect structureST MICROELECTRONICS INC·Filed 2014·Granted Oct 11, 2016·7 cites·18 claims
- 2485US7816253B2Surface treatment of inter-layer dielectricIBM·Filed 2006·Granted Oct 19, 2010·10 cites·6 claims
- 2585US7781332B2Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacerIBM·Filed 2007·Granted Aug 24, 2010·11 cites·14 claims
- 2685US7446058B2Adhesion enhancement for metal/dielectric interfaceIBM·Filed 2006·Granted Nov 4, 2008·10 cites·10 claims
- 2784US10468491B1Low resistance contact for transistorsIBM·Filed 2018·Granted Nov 5, 2019·3 cites·10 claims
- 2884US8481423B2Methods to mitigate plasma damage in organosilicate dielectricsARNOLD JOHN C·Filed 2007·Granted Jul 9, 2013·8 cites·20 claims
- 2983US8415248B2Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming sameCHEN SHYNG-TSONG·Filed 2012·Granted Apr 9, 2013·6 cites·16 claims
- 3082US8519540B2Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming sameCHEN SHYNG-TSONG·Filed 2009·Granted Aug 27, 2013·10 cites·17 claims
- 3181US10818494B2Metal on metal multiple patterningGLOBALFOUNDRIES INC·Filed 2018·Granted Oct 27, 2020·2 cites·20 claims
- 3281US9659820B2Interconnect structure having large self-aligned viasIBM·Filed 2016·Granted May 23, 2017·3 cites·9 claims
- 3381US8129843B2Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacerARNOLD JOHN C·Filed 2010·Granted Mar 6, 2012·5 cites·5 claims
- 3480US10460990B2Semiconductor via structure with lower electrical resistanceIBM·Filed 2017·Granted Oct 29, 2019·2 cites·12 claims
- 3580US7795740B2Adhesion enhancement for metal/dielectric interfaceIBM·Filed 2008·Granted Sep 14, 2010·6 cites·11 claims
- 3680US7122462B2Back end interconnect with a shaped interfaceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 17, 2006·25 cites·5 claims
- 3780US7119018B2Copper conductorIBM·Filed 2004·Granted Oct 10, 2006·20 cites·11 claims
- 3878US10128147B2Interconnect structureIBM·Filed 2018·Granted Nov 13, 2018·2 cites·17 claims
- 3978US7341948B2Method of making a semiconductor structure with a plating enhancement layerIBM·Filed 2006·Granted Mar 11, 2008·8 cites·20 claims
- 4077US7402883B2Back end of the line structures with liner and noble metal layerIBM·Filed 2006·Granted Jul 22, 2008·6 cites·13 claims
- 4176US9887160B2Multiple pre-clean processes for interconnect fabricationINT BUSINESS MACHINES INT·Filed 2015·Granted Feb 6, 2018·2 cites·3 claims
- 4276US9799552B2Low resistance metal contacts to interconnectsIBM·Filed 2015·Granted Oct 24, 2017·2 cites·8 claims
- 4376US7495338B2Metal capped copper interconnectIBM·Filed 2006·Granted Feb 24, 2009·4 cites·20 claims
- 4476US7215006B2Plating seed layer including an oxygen/nitrogen transition region for barrier enhancementIBM·Filed 2005·Granted May 8, 2007·5 cites·15 claims
- 4575US8017522B2Mechanically robust metal/low-κ interconnectsIBM·Filed 2007·Granted Sep 13, 2011·5 cites·15 claims
- 4674US11875987B2Contacts having a geometry to reduce resistanceIBM·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 4774US10784119B2Multiple patterning with lithographically-defined cutsGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 22, 2020·2 cites·20 claims
- 4873US9059251B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2012·Granted Jun 16, 2015·2 cites·15 claims
- 4973US7135398B2Reliable low-k interconnect structure with hybrid dielectricIBM·Filed 2004·Granted Nov 14, 2006·18 cites·28 claims
- 5072US9334572B2Interconnect structure and method of making sameIBM·Filed 2014·Granted May 10, 2016·2 cites·14 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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