P

Inventor

KAWAMURA YOICHIRO

JP26 patents
⚠️ This page may combine multiple inventors who share the name “KAWAMURA YOICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBIDEN CO LTD

18 patents
US7371974B2May 13, 2008

Multilayer printed wiring board

IBIDEN CO LTD43 citations96
US6342682B1Jan 29, 2002

Printed wiring board and manufacturing method thereof

IBIDEN CO LTD51 citations96
US6251502B1Jun 26, 2001

Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

IBIDEN CO LTD58 citations94
US6217988B1Apr 17, 2001

Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

IBIDEN CO LTD38 citations94
US6010768AJan 4, 2000

Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

IBIDEN CO LTD74 citations94
US7714233B2May 11, 2010

Printed wiring board

IBIDEN CO LTD15 citations92
US6831234B1Dec 14, 2004

Multilayer printed circuit board

IBIDEN CO LTD36 citations92
US6384344B1May 7, 2002

Circuit board for mounting electronic parts

IBIDEN CO LTD45 citations92
US6316738B1Nov 13, 2001

Printed wiring board and manufacturing method thereof

IBIDEN CO LTD17 citations92
US8017875B2Sep 13, 2011

Printed wiring board

IBIDEN CO LTD7 citations84
US7472473B2Jan 6, 2009

Solder ball loading apparatus

IBIDEN CO LTD9 citations84
US7475803B2Jan 13, 2009

Solder ball loading method and solder ball loading unit background of the invention

IBIDEN CO LTD13 citations80
US8030579B2Oct 4, 2011

Multilayer printed wiring board

IBIDEN CO LTD3 citations62
US8022314B2Sep 20, 2011

Printed wiring board

IBIDEN CO LTD4 citations62
US8003897B2Aug 23, 2011

Printed wiring board

IBIDEN CO LTD4 citations62
US8001683B2Aug 23, 2011

Solder ball loading method

IBIDEN CO LTD2 citations62
US7866529B2Jan 11, 2011

Solder ball loading method and solder ball loading unit

IBIDEN CO LTD2 citations59
US7823762B2Nov 2, 2010

Manufacturing method and manufacturing apparatus of printed wiring board

IBIDEN CO LTD0 citations46

KAWAMURA YOICHIRO

4 patents

TOYODA YUKIHIKO

2 patents

ASAI MOTOO

1 patent

SHIMIZU KEISUKE

1 patent