Inventor
MA GUANG-HWA
TW26 patents
⚠️ This page may combine multiple inventors who share the name “MA GUANG-HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
9 patentsUS7932146B2Apr 26, 2011
Metal gate transistor and polysilicon resistor and method for fabricating the same
UNITED MICROELECTRONICS CORP52 citations94
US7799630B2Sep 21, 2010
Method for manufacturing a CMOS device having dual metal gate
UNITED MICROELECTRONICS CORP22 citations92
US7608522B2Oct 27, 2009
Method for fabricating a hybrid orientation substrate
UNITED MICROELECTRONICS CORP11 citations84
US7838946B2Nov 23, 2010
Method for fabricating semiconductor structure and structure of static random access memory
UNITED MICROELECTRONICS CORP2 citations63
US7804141B2Sep 28, 2010
Semiconductor element structure and method for making the same
UNITED MICROELECTRONICS CORP4 citations63
US7659189B2Feb 9, 2010
Method for forming fully silicided gate electrode in a semiconductor device
UNITED MICROELECTRONICS CORP2 citations62
US7998818B2Aug 16, 2011
Method for making semiconductor element structure
UNITED MICROELECTRONICS CORP0 citations52
US7682932B2Mar 23, 2010
Method for fabricating a hybrid orientation substrate
UNITED MICROELECTRONICS CORP0 citations52
US7759202B2Jul 20, 2010
Method for forming semiconductor device with gates of different materials
UNITED MICROELECTRONICS CORP0 citations41
SILICONWARE PRECISION INDUSTRIES CO LTD
6 patentsUS9601403B2Mar 21, 2017
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US9875949B2Jan 23, 2018
Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD5 citations71
US9117698B2Aug 25, 2015
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US8970038B2Mar 3, 2015
Semiconductor substrate and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations45
US10242972B2Mar 26, 2019
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
US9076796B2Jul 7, 2015
Interconnection structure for package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
YU CHIH-HAO
4 patentsUS8084824B2Dec 27, 2011
Metal gate transistor and method for fabricating the same
YU CHIH-HAO22 citations91
US8404535B2Mar 26, 2013
Metal gate transistor and method for fabricating the same
YU CHIH-HAO15 citations83
US8193050B2Jun 5, 2012
Method for fabricating semiconductor structure
YU CHIH-HAO12 citations83
US8816439B2Aug 26, 2014
Gate structure of semiconductor device
YU CHIH-HAO2 citations62
UNIMICRON TECHNOLOGY CORP
4 patentsUS11943877B2Mar 26, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations62
US12200861B2Jan 14, 2025
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations52
US12557711B2Feb 17, 2026
Electronic package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US12506056B2Dec 23, 2025
Electronic package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50