Inventor · disambiguated record
Yoon-Hwa Choi
Also filed as: CHOI YOON-HWA
9 granted patents·3 pending applications·672 citations·filing 1999–2021
91Inventor score
Files withHYUNDAI ELECTRONICS IND4FAIRCHILD KR SEMICONDUCTOR LTD3CAMP THERAPEUTICS INC1FAIRCHILD SEMICONDUCTOR1LEE SANG-DO1
Top patents by PatentIndex Score
12 records- 0195US7315077B2Molded leadless package having a partially exposed lead frame padFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Jan 1, 2008·107 cites·27 claims
- 0295US6075284AStack packageHYUNDAI ELECTRONICS IND·Filed 1999·Granted Jun 13, 2000·246 cites·3 claims
- 0393US6621152B2Thin, small-sized power semiconductor packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2001·Granted Sep 16, 2003·91 cites·34 claims
- 0490US6316825B1Chip stack package utilizing a connecting hole to improve electrical connection between leadframesHYUNDAI ELECTRONICS IND·Filed 1999·Granted Nov 13, 2001·112 cites·6 claims
- 0583US6297543B1Chip scale packageHYUNDAI ELECTRONICS IND·Filed 1999·Granted Oct 2, 2001·74 cites·9 claims
- 0680US7541668B2Package frame and semiconductor package using the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2006·Granted Jun 2, 2009·11 cites·13 claims
- 0774US7659531B2Optical coupler packageFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Feb 9, 2010·8 cites·24 claims
- 0870US6677181B2Method for fabricating stacked chip package deviceHYUNDAI ELECTRONICS IND·Filed 2001·Granted Jan 13, 2004·16 cites·10 claims
- 0954US8058735B2Wafer-level chip scale package having stud bump and method for fabricating the sameLEE SANG-DO·Filed 2002·Granted Nov 15, 2011·7 cites·29 claims
- 1044US2023181678A1Novel antibacterial peptide or peptide analog and use thereofCAMP THERAPEUTICS INC·Filed 2021·Application pending·0 cites
- 1137US2005176233A1Wafer-level chip scale package and method for fabricating and using the sameFiled 2003·Application pending·0 cites
- 1237US2004191955A1Wafer-level chip scale package and method for fabricating and using the sameFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →