Inventor
DENG JIE-CHENG
TW12 patents
⚠️ This page may combine multiple inventors who share the name “DENG JIE-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS9601492B1Mar 21, 2017
FinFET devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD34 citations94
US9947592B2Apr 17, 2018
FinFET devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US10510608B2Dec 17, 2019
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10811338B2Oct 20, 2020
Surface treatment method and apparatus for semiconductor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10522444B2Dec 31, 2019
Surface treatment method and apparatus for semiconductor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12402392B2Aug 26, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11251085B2Feb 15, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776880B2Oct 3, 2023
Surface treatment method and apparatus for semiconductor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10943977B2Mar 9, 2021
GAA FET with U-shaped channel
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10510840B2Dec 17, 2019
GAA FET with u-shaped channel
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
FU ZHUN PRECISION IND SHENZHEN
2 patentsUS7518874B2Apr 14, 2009
Heat sink assembly
FU ZHUN PRECISION IND SHENZHEN22 citations92
US7633755B2Dec 15, 2009
Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board
FU ZHUN PRECISION IND SHENZHEN9 citations84