Inventor
POZDER SCOTT K
US21 patents
⚠️ This page may combine multiple inventors who share the name “POZDER SCOTT K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
15 patentsUS6803302B2Oct 12, 2004
Method for forming a semiconductor device having a mechanically robust pad interface
FREESCALE SEMICONDUCTOR INC64 citations95
US7622309B2Nov 24, 2009
Mechanical integrity evaluation of low-k devices with bump shear
FREESCALE SEMICONDUCTOR INC23 citations92
US7169694B2Jan 30, 2007
Method for forming a bond pad interface
FREESCALE SEMICONDUCTOR INC16 citations92
US6951801B2Oct 4, 2005
Metal reduction in wafer scribe area
FREESCALE SEMICONDUCTOR INC51 citations91
US7276435B1Oct 2, 2007
Die level metal density gradient for improved flip chip package reliability
FREESCALE SEMICONDUCTOR INC27 citations90
US7041576B2May 9, 2006
Separately strained N-channel and P-channel transistors
FREESCALE SEMICONDUCTOR INC37 citations89
US7247552B2Jul 24, 2007
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
FREESCALE SEMICONDUCTOR INC12 citations83
US7535078B2May 19, 2009
Semiconductor device having a fuse and method of forming thereof
FREESCALE SEMICONDUCTOR INC11 citations82
US7358616B2Apr 15, 2008
Semiconductor stacked die/wafer configuration and packaging and method thereof
FREESCALE SEMICONDUCTOR INC7 citations74
US7622313B2Nov 24, 2009
Fabrication of three dimensional integrated circuit employing multiple die panels
FREESCALE SEMICONDUCTOR INC2 citations63
US7811932B2Oct 12, 2010
3-D semiconductor die structure with containing feature and method
FREESCALE SEMICONDUCTOR INC4 citations62
US6958548B2Oct 25, 2005
Semiconductor device with magnetically permeable heat sink
FREESCALE SEMICONDUCTOR INC3 citations56
US7378339B2May 27, 2008
Barrier for use in 3-D integration of circuits
FREESCALE SEMICONDUCTOR INC0 citations50
US7153726B2Dec 26, 2006
Semiconductor device with magnetically permeable heat sink
FREESCALE SEMICONDUCTOR INC0 citations46
US7553753B2Jun 30, 2009
Method of forming crack arrest features in embedded device build-up package and package thereof
FREESCALE SEMICONDUCTOR INC0 citations41
MOTOROLA INC
4 patentsUS6531384B1Mar 11, 2003
Method of forming a bond pad and structure thereof
MOTOROLA INC55 citations93
US6429531B1Aug 6, 2002
Method and apparatus for manufacturing an interconnect structure
MOTOROLA INC52 citations92
US6294458B1Sep 25, 2001
Semiconductor device adhesive layer structure and process for forming structure
MOTOROLA INC36 citations92
US6420208B1Jul 16, 2002
Method of forming an alternative ground contact for a semiconductor die
MOTOROLA INC45 citations90