Inventor
WITT CHRISTIAN
US17 patents
⚠️ This page may combine multiple inventors who share the name “WITT CHRISTIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ENTHONE
7 patentsUS7410899B2Aug 12, 2008
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE21 citations91
US7393781B2Jul 1, 2008
Capping of metal interconnects in integrated circuit electronic devices
ENTHONE10 citations84
US7332193B2Feb 19, 2008
Cobalt and nickel electroless plating in microelectronic devices
ENTHONE16 citations83
US7268074B2Sep 11, 2007
Capping of metal interconnects in integrated circuit electronic devices
ENTHONE9 citations73
US7615491B2Nov 10, 2009
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE4 citations72
US7611988B2Nov 3, 2009
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE7 citations72
US7611987B2Nov 3, 2009
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE6 citations72
GLOBALFOUNDRIES INC
5 patentsUS8932934B2Jan 13, 2015
Methods of self-forming barrier integration with pore stuffed ULK material
GLOBALFOUNDRIES INC6 citations83
US10580696B1Mar 3, 2020
Interconnects formed by a metal displacement reaction
GLOBALFOUNDRIES INC3 citations72
US9054052B2Jun 9, 2015
Methods for integration of pore stuffing material
GLOBALFOUNDRIES INC3 citations62
US9236299B2Jan 12, 2016
Methods of forming a metal cap layer on copper-based conductive structures on an integrated circuit device
GLOBALFOUNDRIES INC1 citations52
US9768058B2Sep 19, 2017
Methods of forming air gaps in metallization layers on integrated circuit products
GLOBALFOUNDRIES INC1 citations51