Inventor · disambiguated record

I-Tai Liu

Also filed as: LIU I-TAI

4 granted patents·108 citations·filing 2006–2010

76Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG2 TAIWAN SEMINCONDUCTOR MFG CO L1 TSAO PEI-HAW1

Top patents by PatentIndex Score

4 records

0195US7719122B2System-in-package packaging for minimizing bond wire contamination and yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 18, 2010·72 cites·6 claims
0291US7659632B2Solder bump structure and method of manufacturing sameTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2006·Granted Feb 9, 2010·30 cites·20 claims
0372US7679180B2Bond pad design to minimize dielectric crackingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 16, 2010·6 cites·14 claims
0439US8217520B2System-in-package packaging for minimizing bond wire contamination and yield lossTSAO PEI-HAW·Filed 2010·Granted Jul 10, 2012·0 cites·5 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →