Inventor
LEE TIEN-YU
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LEE TIEN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
9 patentsUS10529645B2Jan 7, 2020
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
XILINX INC26 citations93
US10043730B2Aug 7, 2018
Stacked silicon package assembly having an enhanced lid
XILINX INC19 citations92
US10319606B1Jun 11, 2019
Chip package assembly with enhanced interconnects and method for fabricating the same
XILINX INC2 citations72
US11355412B2Jun 7, 2022
Stacked silicon package assembly having thermal management
XILINX INC1 citations62
US9204542B1Dec 1, 2015
Multi-use package substrate
XILINX INC2 citations62
US11315858B1Apr 26, 2022
Chip package assembly with enhanced solder resist crack resistance
XILINX INC1 citations60
US10930611B1Feb 23, 2021
Solder joints for board level reliability
XILINX INC0 citations51
US10527670B2Jan 7, 2020
Testing system for lid-less integrated circuit packages
XILINX INC0 citations51
US10096502B2Oct 9, 2018
Method and apparatus for assembling and testing a multi-integrated circuit package
XILINX INC0 citations51