Inventor
KIM KIL-SOO
KR17 patents
⚠️ This page may combine multiple inventors who share the name “KIM KIL-SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS7064435B2Jun 20, 2006
Semiconductor package with improved ball land structure
SAMSUNG ELECTRONICS CO LTD109 citations96
US11309300B2Apr 19, 2022
Semiconductor package including processor chip and memory chip
SAMSUNG ELECTRONICS CO LTD2 citations72
US9299685B2Mar 29, 2016
Multi-chip package having a logic chip disposed in a package substrate opening and connecting to an interposer
SAMSUNG ELECTRONICS CO LTD4 citations72
US11309280B2Apr 19, 2022
Semiconductor device package
SAMSUNG ELECTRONICS CO LTD0 citations62
US10727199B2Jul 28, 2020
Electronic device including semiconductor device package
SAMSUNG ELECTRONICS CO LTD1 citations62
US10699983B2Jun 30, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12482800B2Nov 25, 2025
Semiconductor package including processor chip and memory chip
SAMSUNG ELECTRONICS CO LTD0 citations61
US11205637B2Dec 21, 2021
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics
SAMSUNG ELECTRONICS CO LTD0 citations59
US10797021B2Oct 6, 2020
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics
SAMSUNG ELECTRONICS CO LTD0 citations48
US9691737B2Jun 27, 2017
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations40
US8018071B2Sep 13, 2011
Stacked structure using semiconductor devices and semiconductor device package including the same
SAMSUNG ELECTRONICS CO LTD0 citations40