Inventor · disambiguated record
Jan Zinger
Also filed as: ZINGER JAN
13 granted patents·3,658 citations·filing 1995–2004
96Inventor score
Technology areasH10P
Top patents by PatentIndex Score
13 records- 0198US6876191B2Apparatus for treating wafers, provided with a sensor boxASM INT·Filed 2003·Granted Apr 5, 2005·419 cites·22 claims
- 0297US6607602B1Device for processing semiconductor wafersASM INT·Filed 1998·Granted Aug 19, 2003·349 cites·22 claims
- 0397US6357984B1Storage assembly for wafersASM INT·Filed 1998·Granted Mar 19, 2002·356 cites·9 claims
- 0496US6985788B2Method and system to process semiconductor wafersASM INTERNAT NV·Filed 2004·Granted Jan 10, 2006·473 cites·9 claims
- 0596US6981832B2Wafer handling systemASM INTERNAT NV·Filed 2003·Granted Jan 3, 2006·497 cites·21 claims
- 0696US6732006B2Method and system to process semiconductor wafersASM INTERNAT NV·Filed 2002·Granted May 4, 2004·491 cites·79 claims
- 0796US6481945B1Method and device for transferring wafersASM INT·Filed 1999·Granted Nov 19, 2002·540 cites·6 claims
- 0894US5768125AApparatus for transferring a substantially circular articleASM INT·Filed 1995·Granted Jun 16, 1998·403 cites·12 claims
- 0989US6746237B2Method and device for heat treating substratesASM INT·Filed 2002·Granted Jun 8, 2004·48 cites·36 claims
- 1087US6632068B2Wafer handling systemASM INT·Filed 2001·Granted Oct 14, 2003·43 cites·8 claims
- 1178US6940047B2Heat treatment apparatus with temperature control systemASM INT·Filed 2003·Granted Sep 6, 2005·27 cites·71 claims
- 1267US6964751B2Method and device for heat treating substratesASM INT·Filed 2004·Granted Nov 15, 2005·10 cites·11 claims
- 1346US6889149B2System and method for fingerprinting of semiconductor processing toolsASM INT·Filed 2003·Granted May 3, 2005·2 cites·24 claims
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