Inventor
ROTHWELL MARY E
US16 patents
⚠️ This page may combine multiple inventors who share the name “ROTHWELL MARY E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS9520547B2Dec 13, 2016
Chip mode isolation and cross-talk reduction through buried metal layers and through-vias
IBM28 citations94
US9397283B2Jul 19, 2016
Chip mode isolation and cross-talk reduction through buried metal layers and through-vias
IBM24 citations94
US9219298B2Dec 22, 2015
Removal of spurious microwave modes via flip-chip crossover
IBM14 citations92
US9177814B2Nov 3, 2015
Suspended superconducting qubits
IBM17 citations92
US7855455B2Dec 21, 2010
Lock and key through-via method for wafer level 3 D integration and structures produced
IBM35 citations91
US9455392B2Sep 27, 2016
Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossover
IBM12 citations84
US10008655B2Jun 26, 2018
Suspended superconducting qubits
IBM2 citations73
US9716219B2Jul 25, 2017
Suspended superconducting qubits
IBM2 citations73
US9531055B2Dec 27, 2016
Removal of spurious microwave modes via flip-chip crossover
IBM4 citations73
US11168234B2Nov 9, 2021
Enhanced adhesive materials and processes for 3D applications
IBM0 citations62
US11683995B2Jun 20, 2023
Lithography for fabricating Josephson junctions
IBM0 citations59
US10767084B2Sep 8, 2020
Enhanced adhesive materials and processes for 3D applications
IBM0 citations52