P
US9716219B2ActiveUtilityPatentIndex 73

Suspended superconducting qubits

Assignee: IBMPriority: Mar 15, 2013Filed: Aug 19, 2013Granted: Jul 25, 2017
Est. expiryMar 15, 2033(~6.7 yrs left)· nominal 20-yr term from priority
Inventors:CHANG JOSEPHINE BKEEFE GEORGE ARIGETTI CHAD TROTHWELL MARY E
H10P 52/00G06N 99/002H01L 39/223H01L 39/045H01L 39/2493H01L 27/18H01L 21/304H10N 69/00H10N 60/0912H10N 60/815H10N 60/12
73
PatentIndex Score
2
Cited by
27
References
6
Claims

Abstract

A qubit system includes a substrate layer, a qubit circuit suspended above the substrate layer and fine structure disposed between the qubit circuit and the substrate layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method of fabricating a qubit system, the method comprising:
 forming a qubit circuit on a substrate; and 
 undercutting the substrate such that fine structures remain suspending the qubit circuit above remaining substrate; 
 wherein the qubit circuit is a trilayer material stack having a suspended portion disposed between anchored larger portions at opposing ends of the suspended portion; 
 wherein the fine structures are portions of the substrate that have been undercut, and the anchored larger portions are only partially undercut from the substrate such that a mid-portion of a bottom surface of the anchored larger portions are in contact with the substrate, and outer portions of the bottom surface of the anchored larger portions are not in contact with the substrate; 
 wherein each of the fine structures separately suspends different parts of the qubit circuit on a one-to-one basis, each of the different parts being held individually by the fine structures, such that a perimeter of each of the different parts are suspended in the air above the substrate by touching the fine structures underneath each of the different parts of the qubit circuit on a one-to-one basis; 
 wherein each of the fine structures is wider at a bottom and narrows at a top, such that a width of the fine structures is larger at the bottom than the top. 
 
     
     
       2. The method as claimed in  claim 1  wherein the fine structure couples the qubit circuit to the substrate layer. 
     
     
       3. The method as claimed in  claim 1  wherein a substrate-to-air interface is removed from electric fields of the resonant modes of the quantum circuit. 
     
     
       4. The method as claimed in  claim 1 , wherein the undercut structure is formed by undercutting along the perimeter of features of the qubit circuit. 
     
     
       5. The method as claimed in  claim 1 , wherein the substrate is a on a Si-on-sapphire (SOS) substrate. 
     
     
       6. The method as claimed in  claim 5  wherein a silicon (Si) portion of the SOS substrate is removed to form the fine structure.

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