Inventor · disambiguated record
Gerhard Heier
Also filed as: HEIER GERHARD
8 granted patents·3 pending applications·178 citations·filing 2000–2010
88Inventor score
Technology areasH10P
Files withWACKER SILTRONIC HALBLEITERMAT5SILTRONIC AG4ROETTGER KLAUS1WACKER SILTRONIC GES F DOT OVE1
Top patents by PatentIndex Score
11 records- 0186US6514424B2Process for the double-side polishing of semiconductor wafers and carrier for carrying out the processWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Granted Feb 4, 2003·39 cites·14 claims
- 0285US6899762B2Epitaxially coated semiconductor wafer and process for producing itSILTRONIC AG·Filed 2003·Granted May 31, 2005·42 cites·11 claims
- 0381US6583050B2Semiconductor wafer with improved flatness, and process for producing the semiconductor waferWACKER SILTRONIC GES F DOT OVE·Filed 2002·Granted Jun 24, 2003·31 cites·1 claims
- 0481US6458688B1Semiconductor wafer with improved flatness, and process for producing the semiconductor waferWACKER SILTRONIC HALBLEITERMAT·Filed 2000·Granted Oct 1, 2002·27 cites·15 claims
- 0573US6793837B2Process for material-removing machining of both sides of semiconductor wafersSILTRONIC AG·Filed 2002·Granted Sep 21, 2004·18 cites·14 claims
- 0671US6645862B2Double-side polishing process with reduced scratch rate and device for carrying out the processWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Granted Nov 11, 2003·16 cites·11 claims
- 0769US7541287B2Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the methodSILTRONIC AG·Filed 2006·Granted Jun 2, 2009·3 cites·6 claims
- 0858US8242020B2Method for producing a semiconductor waferROETTGER KLAUS·Filed 2009·Granted Aug 14, 2012·2 cites·7 claims
- 0936US2002055324A1Process for polishing silicon wafersWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Application pending·0 cites
- 1035US2001014570A1Process for producing a semiconductor wafer with polished edgeWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Application pending·0 cites
- 1133US2010210188A1Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor WafersSILTRONIC AG·Filed 2010·Application pending·0 cites
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