Inventor
WU YEN-LIANG
TW33 patents
⚠️ This page may combine multiple inventors who share the name “WU YEN-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
30 patentsUS10062764B1Aug 28, 2018
Semiconductor device having void between gate electrode and sidewall spacer and manufacturing method thereof
UNITED MICROELECTRONICS CORP19 citations93
US9166024B2Oct 20, 2015
FinFET structure with cavities and semiconductor compound portions extending laterally over sidewall spacers
UNITED MICROELECTRONICS CORP23 citations91
US9786510B2Oct 10, 2017
Fin-shaped structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP5 citations84
US9385191B2Jul 5, 2016
FINFET structure
UNITED MICROELECTRONICS CORP10 citations83
US10050146B2Aug 14, 2018
Semiconductor device and method of forming the same
UNITED MICROELECTRONICS CORP2 citations73
US9502530B2Nov 22, 2016
Method of manufacturing semiconductor devices
UNITED MICROELECTRONICS CORP4 citations73
US9224864B1Dec 29, 2015
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP4 citations73
US10170573B1Jan 1, 2019
Semiconductor device and fabrication method thereof
UNITED MICROELECTRONICS CORP6 citations72
US9899523B2Feb 20, 2018
Semiconductor structure
UNITED MICROELECTRONICS CORP5 citations72
US9691901B2Jun 27, 2017
Semiconductor device
UNITED MICROELECTRONICS CORP6 citations72
US9627538B2Apr 18, 2017
Fin field effect transistor and method of manufacturing the same
UNITED MICROELECTRONICS CORP2 citations72
US9601600B2Mar 21, 2017
Processes for fabricating FinFET structures with semiconductor compound portions formed in cavities and extending over sidewall spacers
UNITED MICROELECTRONICS CORP3 citations72
US9362382B1Jun 7, 2016
Method for forming semiconductor device with low sealing loss
UNITED MICROELECTRONICS CORP2 citations63
US10930517B2Feb 23, 2021
Method of forming fin-shaped structure
UNITED MICROELECTRONICS CORP0 citations62
US8829575B2Sep 9, 2014
Semiconductor structure and process thereof
UNITED MICROELECTRONICS CORP2 citations62
US8753902B1Jun 17, 2014
Method of controlling etching process for forming epitaxial structure
UNITED MICROELECTRONICS CORP3 citations62
US11239082B2Feb 1, 2022
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP1 citations61
US10529856B2Jan 7, 2020
Method of forming semiconductor device
UNITED MICROELECTRONICS CORP0 citations52
US10418251B2Sep 17, 2019
Method of forming fin-shaped structure having ladder-shaped cross-sectional profile
UNITED MICROELECTRONICS CORP0 citations52
US9634125B2Apr 25, 2017
Fin field effect transistor device and fabrication method thereof
UNITED MICROELECTRONICS CORP1 citations52
US9397190B2Jul 19, 2016
Fabrication method of semiconductor structure
UNITED MICROELECTRONICS CORP0 citations52
US9214395B2Dec 15, 2015
Method of manufacturing semiconductor devices
UNITED MICROELECTRONICS CORP1 citations52
US9018066B2Apr 28, 2015
Method of fabricating semiconductor device structure
UNITED MICROELECTRONICS CORP1 citations52
US10468493B2Nov 5, 2019
Method for manufacturing gate stack structure
UNITED MICROELECTRONICS CORP0 citations51
US10388749B2Aug 20, 2019
Manufacturing method of semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US10186594B2Jan 22, 2019
Semiconductor device having metal gate
UNITED MICROELECTRONICS CORP0 citations51
US9685541B2Jun 20, 2017
Method for forming semiconductor structure
UNITED MICROELECTRONICS CORP0 citations51
US9461147B2Oct 4, 2016
Semiconductor structure
UNITED MICROELECTRONICS CORP0 citations51
US10366896B2Jul 30, 2019
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations50
US10002966B1Jun 19, 2018
Field effect transistor and device thereof
UNITED MICROELECTRONICS CORP0 citations50