Inventor · disambiguated record
Chung-Fa Lee
Also filed as: LEE CHUNG-FA
7 granted patents·3 pending applications·15 citations·filing 2008–2024
78Inventor score
Top patents by PatentIndex Score
10 records- 0197US11227846B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Jan 18, 2022·7 cites·14 claims
- 0286US9000581B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Apr 7, 2015·7 cites·19 claims
- 0380US11302657B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Apr 12, 2022·1 cites·9 claims
- 0475US11967570B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2022·Granted Apr 23, 2024·0 cites·12 claims
- 0573US11705413B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 0656US9184107B2Semiconductor packageMEDIATEK INC·Filed 2014·Granted Nov 10, 2015·0 cites·11 claims
- 0755US2024314920A1Electronic systemMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0851US2024304534A1Thermally improved substrate structure and package assembly with the sameMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0941US2009194252A1Heat dissipation module and supporting element thereofLEE CHENG-CHIH·Filed 2008·Application pending·0 cites
- 1038US9252068B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Feb 2, 2016·0 cites·7 claims
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