Inventor
OYA DAISUKE
JP16 patents
⚠️ This page may combine multiple inventors who share the name “OYA DAISUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
14 patentsUSD798832SOct 3, 2017
Power semiconductor device
MITSUBISHI ELECTRIC CORP35 citations93
USD790491SJun 27, 2017
Power semiconductor device
MITSUBISHI ELECTRIC CORP23 citations93
US10898946B2Jan 26, 2021
Semiconductor-mounting heat dissipation base plate and production method therefor
MITSUBISHI ELECTRIC CORP3 citations73
US10483176B2Nov 19, 2019
Semiconductor module
MITSUBISHI ELECTRIC CORP4 citations71
US11484936B2Nov 1, 2022
Semiconductor-mounting heat dissipation base plate and production method therefor
MITSUBISHI ELECTRIC CORP0 citations62
US10340217B2Jul 2, 2019
Semiconductor device including a cylindrical electrode inserted into a looped portion of an electrode
MITSUBISHI ELECTRIC CORP1 citations62
US12308305B2May 20, 2025
Power semiconductor device
MITSUBISHI ELECTRIC CORP0 citations61
US11887904B2Jan 30, 2024
Integrally bonded semiconductor device and power converter including the same
MITSUBISHI ELECTRIC CORP0 citations61
US11569141B2Jan 31, 2023
Semiconductor device including a groove within a resin insulating part positioned between and covering parts of a first electrode and a second electrode
MITSUBISHI ELECTRIC CORP0 citations61
US10748830B2Aug 18, 2020
Semiconductor device
MITSUBISHI ELECTRIC CORP1 citations61
US10651121B2May 12, 2020
Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion
MITSUBISHI ELECTRIC CORP0 citations51
USD827590SSep 4, 2018
Power semiconductor device
MITSUBISHI ELECTRIC CORP1 citations51
US11271043B2Mar 8, 2022
Semiconductor module and power conversion apparatus
MITSUBISHI ELECTRIC CORP0 citations49
US9445497B2Sep 13, 2016
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations41