Inventor

YANG TAI-I

TW87 patents

⚠️ This page may combine multiple inventors who share the name “YANG TAI-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG TAI-I

TAIWAN SEMICONDUCTOR MFG CO LTD

Air-gap forming techniques for interconnect structures

Structure and formation method of interconnection structure of semiconductor device

Structure and method for interconnection with self-alignment

Semiconductor device and method of manufacture

Hybrid copper structure for advance interconnect usage

Interconnect structure with air-gaps

Hybrid copper structure for advance interconnect usage

Combination interconnect structure and methods of forming same

Deep trench spacing isolation for complementary metal-oxide-semiconductor (CMOS) image sensors

Interconnect structure with air-gaps

Semiconductor device and method of manufacture

Semiconductor structure and method for manufacturing the same

Methods for fabricating a low-resistance interconnect

Hybrid copper structure for advance interconnect usage

Structure and formation method of semiconductor device with self-aligned conductive features

Interconnect structure with air gaps

Nano-electromechanical system (NEMS) device structure and method for forming the same

Multi-metal fill with self-aligned patterning and dielectric with voids

Interconnect structure including air gap

Gate all around device and fabrication thereof

Semiconductor arrangement and formation thereof

Multi-metal fill with self-align patterning

Nano-electromechanical system (NEMS) device structure and method for forming the same

Semiconductor arrangement and formation thereof

Air-gap forming techniques for interconnect structures

Semiconductor arrangement and formation thereof

Method for manufacturing a semiconductor structure having a trench with high aspect ratio

Metal line structure and method

Semiconductor isolation structure with air gaps in deep trenches

Method of providing a workpiece including low resistance interconnect low-resistance interconnect

Semiconductor structure including low-resistance interconnect and integrated circuit device having the same

Interconnect structure with air-gaps

Nano-electromechanical system (NEMS) device structure and method for forming the same

Interconnect structure with air-gaps

Interconnect structure with air-gaps

Semiconductor device with self-aligned conductive features

Semiconductor device and method of manufacture

Gate all around device

Integrated circuit interconnect structures with air gaps

Metal line structure and method

Interconnect structure and manufacturing method for the same

Multi-metal fill with self-aligned patterning and dielectric with voids

Structure and method for interconnection with self-alignment

Multi-metal fill with self-aligned patterning and dielectric with voids

Method for forming semiconductor device with self-aligned conductive features

Fabrication of gate all around device

Integrated circuit interconnect structures with air gaps

Semiconductor arrangement and formation thereof

SHUE HONG-SENG

Semiconductor isolation structure with air gaps in deep trenches

VANGUARD INT SEMICONDUCT CORP

Magnetoresistive devices and methods for forming the same