Structure and formation method of semiconductor device with self-aligned conductive features

Abstract

Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a conductive line over the semiconductor substrate. The semiconductor device structure also includes a conductive via on the conductive line. The conductive via has an upper portion and a protruding portion. The protruding portion extends from a bottom of the upper portion towards the conductive line. The bottom of the upper portion is wider than a top of the upper portion. The semiconductor device structure further includes a dielectric layer over the semiconductor substrate, and the dielectric layer surrounds the conductive line and the conductive via.

What is claimed is: 
     
       1. A semiconductor device structure, comprising:
 a semiconductor substrate; 
 a conductive line over the semiconductor substrate; 
 a conductive via above the conductive line, wherein the conductive via has an upper portion and a protruding portion entirely below an entirety of the upper portion, the protruding portion extends from a bottom of the upper portion towards the conductive line, and the bottom of the upper portion is wider than a top of the upper portion and is wider than a top of the protruding portion, and wherein the conductive line shrinks along a direction from a bottom of the conductive line towards the conductive via; and 
 a dielectric layer over the semiconductor substrate, wherein the dielectric layer surrounds the conductive line and the conductive via. 
 
     
     
       2. The semiconductor device structure as claimed in  claim 1 , further comprising an insulating element over the conductive line, wherein the insulating element surrounds the protruding portion of the conductive via. 
     
     
       3. The semiconductor device structure as claimed in  claim 2 , wherein materials of the insulating element and the dielectric layer are different from each other. 
     
     
       4. The semiconductor device structure as claimed in  claim 2 , wherein the insulating element is shorter than the conductive line. 
     
     
       5. The semiconductor device structure as claimed in  claim 2 , wherein the insulating element is as thick as the protruding portion of the conductive via. 
     
     
       6. The semiconductor device structure as claimed in  claim 1 , wherein the upper portion of the conductive via shrinks along a direction from the bottom towards the top of the upper portion of the conductive via. 
     
     
       7. The semiconductor device structure as claimed in  claim 1 , wherein materials of the conductive line and the conductive via are different from each other. 
     
     
       8. The semiconductor device structure as claimed in  claim 1 , further comprising:
 a second conductive line over the semiconductor substrate; and 
 a closed hole formed in the dielectric layer, wherein the closed hole is between a sidewall of the conductive line and a sidewall of the second conductive line. 
 
     
     
       9. The semiconductor device structure as claimed in  claim 1 , further comprising a second conductive line over the conductive via and the dielectric layer, wherein a bottom of the second conductive line is not wider than a top of the second conductive line. 
     
     
       10. The semiconductor device structure as claimed in  claim 1 , further comprising:
 an insulating element over the conductive line and surrounding the protruding portion of the conductive via, wherein a top view of the insulating element is ring-shaped. 
 
     
     
       11. The semiconductor device structure as claimed in  claim 1 , wherein the conductive line has a barrier region surrounding an inner portion of the conductive line, and the barrier region has a greater dopant concentration than the inner portion. 
     
     
       12. A semiconductor device structure, comprising:
 a semiconductor substrate; 
 a conductive line over the semiconductor substrate, wherein the conductive line shrinks along a direction from a lower portion of the conductive line towards an upper portion of the conductive line; 
 a conductive via on the conductive line, wherein the conductive via shrinks along a direction from a lower portion of the conductive via towards an upper portion of the conductive via; 
 an insulating element over the conductive line and surrounding a protruding portion of the conductive via, wherein a top view of the insulating element is ring-shaped; and 
 a dielectric layer over the semiconductor substrate, wherein the dielectric layer surrounds the conductive line and the conductive via. 
 
     
     
       13. The semiconductor device structure as claimed in  claim 12 , wherein the insulating element has a greater etching resistance than the dielectric layer. 
     
     
       14. The semiconductor device structure as claimed in  claim 12 , wherein the conductive line has a barrier region surrounding an inner portion of the conductive line, the barrier region has a greater dopant concentration than the inner portion, and the barrier region does not extend across an entirety of a bottom surface of the inner portion. 
     
     
       15. The semiconductor device structure as claimed in  claim 12 , wherein the conductive via has a single layer structure and is in direct contact with the conductive line. 
     
     
       16. A semiconductor device structure, comprising:
 a substrate; 
 a first conductive feature over the substrate; 
 a second conductive feature above the first conductive feature, wherein the second conductive feature has an upper portion and a protruding portion, the protruding portion is below the upper portion and extends towards the first conductive feature, and a bottom of the upper portion is wider than a top of the upper portion and is wider than a top of the protruding portion; and 
 a dielectric layer surrounding the first conductive feature and the second conductive feature; and 
 a closed hole in the dielectric layer. 
 
     
     
       17. The semiconductor device structure as claimed in  claim 16 , further comprising an insulating element over the first conductive feature, wherein the insulating element surrounds the protruding portion of the second conductive feature, and a top view of the insulating element is ring-shaped. 
     
     
       18. The semiconductor device structure as claimed in  claim 17 , wherein the insulating element is as thick as the protruding portion of the second conductive feature. 
     
     
       19. The semiconductor device structure as claimed in  claim 16 , wherein the upper portion of the second conductive feature shrinks along a direction from the bottom of the upper portion towards a top of the upper portion. 
     
     
       20. The semiconductor device structure as claimed in  claim 16 , wherein the first conductive feature has a barrier region surrounding an inner portion of the first conductive feature, and the barrier region has a greater dopant concentration than the inner portion.