Inventor
FAUST RICHARD ALLEN
US6 patents
Patents
6 patentsUS9455312B2Sep 27, 2016
Multiple depth vias in an integrated circuit
TEXAS INSTRUMENTS INC6 citations82
US6927159B2Aug 9, 2005
Methods for providing improved layer adhesion in a semiconductor device
TEXAS INSTRUMENTS INC8 citations71
US8980723B2Mar 17, 2015
Multiple depth vias in an integrated circuit
TEXAS INSTRUMENTS INC1 citations61
US9082649B2Jul 14, 2015
Passivation process to prevent TiW corrosion
TEXAS INSTRUMENTS INC2 citations59
US9230887B2Jan 5, 2016
Multiple depth vias in an integrated circuit
TEXAS INSTRUMENTS INC0 citations50
US12159846B2Dec 3, 2024
Process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch
TEXAS INSTRUMENTS INC0 citations43