Inventor
CARL DANIEL A
US23 patents
⚠️ This page may combine multiple inventors who share the name “CARL DANIEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
20 patentsUS6258223B1Jul 10, 2001
In-situ electroless copper seed layer enhancement in an electroplating system
APPLIED MATERIALS INC399 citations99
US6811680B2Nov 2, 2004
Planarization of substrates using electrochemical mechanical polishing
APPLIED MATERIALS INC102 citations98
US6436267B1Aug 20, 2002
Method for achieving copper fill of high aspect ratio interconnect features
APPLIED MATERIALS INC105 citations98
US6773507B2Aug 10, 2004
Apparatus and method for fast-cycle atomic layer deposition
APPLIED MATERIALS INC124 citations97
US6884724B2Apr 26, 2005
Method for dishing reduction and feature passivation in polishing processes
APPLIED MATERIALS INC50 citations93
US6821881B2Nov 23, 2004
Method for chemical mechanical polishing of semiconductor substrates
APPLIED MATERIALS INC17 citations93
US7427568B2Sep 23, 2008
Method of forming an interconnect structure
APPLIED MATERIALS INC20 citations92
US7115516B2Oct 3, 2006
Method of depositing a material layer
APPLIED MATERIALS INC18 citations92
US7066800B2Jun 27, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC31 citations92
US6988942B2Jan 24, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC41 citations92
US7772121B2Aug 10, 2010
Method of forming a trench structure
APPLIED MATERIALS INC12 citations84
US6677239B2Jan 13, 2004
Methods and compositions for chemical mechanical polishing
APPLIED MATERIALS INC16 citations84
US7137879B2Nov 21, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC7 citations74
US6896776B2May 24, 2005
Method and apparatus for electro-chemical processing
APPLIED MATERIALS INC4 citations63
US6893548B2May 17, 2005
Method of conditioning electrochemical baths in plating technology
APPLIED MATERIALS INC5 citations63
US7344432B2Mar 18, 2008
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
APPLIED MATERIALS INC3 citations60
US7375023B2May 20, 2008
Method and apparatus for chemical mechanical polishing of semiconductor substrates
APPLIED MATERIALS INC0 citations52
US7323095B2Jan 29, 2008
Integrated multi-step gap fill and all feature planarization for conductive materials
APPLIED MATERIALS INC0 citations52
US7311592B2Dec 25, 2007
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC1 citations52
US7060606B2Jun 13, 2006
Method and apparatus for chemical mechanical polishing of semiconductor substrates
APPLIED MATERIALS INC0 citations52