Inventor · disambiguated record
Jeonghun Cho
Also filed as: CHO JEONGHUN
10 granted patents·10 citations·filing 2017–2022
81Inventor score
Technology areasH10W
Files withJMJ KOREA CO LTD10
Top patents by PatentIndex Score
10 records- 0191US11676931B2Semiconductor packageJMJ KOREA CO LTD·Filed 2022·Granted Jun 13, 2023·2 cites·13 claims
- 0290US11270969B2Semiconductor packageJMJ KOREA CO LTD·Filed 2020·Granted Mar 8, 2022·3 cites·18 claims
- 0381US11682610B2Semiconductor package with heat radiation boardJMJ KOREA CO LTD·Filed 2020·Granted Jun 20, 2023·1 cites·18 claims
- 0476US10438873B2Semiconductor chip package having heat dissipating structureJMJ KOREA CO LTD·Filed 2017·Granted Oct 8, 2019·3 cites·3 claims
- 0565US10204848B2Semiconductor chip package having heat dissipating structureJMJ KOREA CO LTD·Filed 2018·Granted Feb 12, 2019·1 cites·5 claims
- 0656US11171074B2Heat sink board, manufacturing method thereof, and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·17 claims
- 0754US11482463B2Vertically attaching a chip to a substrateJMJ KOREA CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·18 claims
- 0854US11289397B2Heat sink board for a semiconductor deviceJMJ KOREA CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·16 claims
- 0953US11362021B2Pressurizing members for semiconductor packageJMJ KOREA CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·18 claims
- 1038US11056420B2Pressing-type semiconductor power device packageJMJ KOREA CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →