P

Inventor

YOSHIDA NAOMI

US52 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIDA NAOMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

39 patents
US6488984B1Dec 3, 2002

Film deposition method and apparatus

APPLIED MATERIALS INC231 citations98
US9484406B1Nov 1, 2016

Method for fabricating nanowires for horizontal gate all around devices for semiconductor applications

APPLIED MATERIALS INC79 citations97
US10177227B1Jan 8, 2019

Method for fabricating junctions and spacers for horizontal gate all around devices

APPLIED MATERIALS INC40 citations92
US5953630ASep 14, 1999

Suppression of tungsten film deposition on a semiconductor wafer bevel edge with a halogenide purge gas

APPLIED MATERIALS INC32 citations90
US9865735B2Jan 9, 2018

Horizontal gate all around and FinFET device isolation

APPLIED MATERIALS INC4 citations83
US9673277B2Jun 6, 2017

Methods and apparatus for forming horizontal gate all around device structures

APPLIED MATERIALS INC13 citations83
US9460920B1Oct 4, 2016

Horizontal gate all around device isolation

APPLIED MATERIALS INC15 citations83
US10777650B2Sep 15, 2020

Horizontal gate all around device nanowire air gap spacer formation

APPLIED MATERIALS INC5 citations82
US10608097B2Mar 31, 2020

Low thickness dependent work-function nMOS integration for metal gate

APPLIED MATERIALS INC2 citations73
US10109534B2Oct 23, 2018

Multi-threshold voltage (Vt) workfunction metal by selective atomic layer deposition (ALD)

APPLIED MATERIALS INC5 citations73
US9748354B2Aug 29, 2017

Multi-threshold voltage structures with a lanthanum nitride film and methods of formation thereof

APPLIED MATERIALS INC5 citations73
US6852626B1Feb 8, 2005

Film deposition method and apparatus

APPLIED MATERIALS INC9 citations73
US11245022B2Feb 8, 2022

Integrated dipole flow for transistor

APPLIED MATERIALS INC2 citations72
US11145761B2Oct 12, 2021

Horizontal gate all around and FinFET device isolation

APPLIED MATERIALS INC2 citations72
US10573719B2Feb 25, 2020

Horizontal gate all around device isolation

APPLIED MATERIALS INC2 citations72
US10490666B2Nov 26, 2019

Horizontal gate all around and FinFET device isolation

APPLIED MATERIALS INC1 citations72
US10727080B2Jul 28, 2020

Tantalum-containing material removal

APPLIED MATERIALS INC4 citations71
US7365529B2Apr 29, 2008

Test structure design for reliability test

APPLIED MATERIALS INC2 citations63
US12543547B2Feb 3, 2026

Method of dielectric material fill and treatment

APPLIED MATERIALS INC0 citations62
US12046508B2Jul 23, 2024

Method of dielectric material fill and treatment

APPLIED MATERIALS INC0 citations62
US11894233B2Feb 6, 2024

Electronic device having an oxygen free platinum group metal film

APPLIED MATERIALS INC0 citations62
US11615984B2Mar 28, 2023

Method of dielectric material fill and treatment

APPLIED MATERIALS INC0 citations62
US11488830B2Nov 1, 2022

Oxygen free deposition of platinum group metal films

APPLIED MATERIALS INC0 citations62
US6576567B1Jun 10, 2003

Film deposition method and apparatus for semiconductor devices

APPLIED MATERIALS INC3 citations62
US6511538B1Jan 28, 2003

Film deposition method and apparatus for semiconductor devices

APPLIED MATERIALS INC3 citations62
US11888045B2Jan 30, 2024

Integrated dipole flow for transistor

APPLIED MATERIALS INC0 citations61
US11848369B2Dec 19, 2023

Horizontal gate-all-around device nanowire air gap spacer formation

APPLIED MATERIALS INC0 citations61
US11830725B2Nov 28, 2023

Method of cleaning a structure and method of depositing a capping layer in a structure

APPLIED MATERIALS INC0 citations61
US11282936B2Mar 22, 2022

Horizontal gate all around device nanowire air gap spacer formation

APPLIED MATERIALS INC0 citations61
US11075276B2Jul 27, 2021

Methods and apparatus for n-type metal oxide semiconductor (NMOS) metal gate materials using atomic layer deposition (ALD) processes with metal based precursors

APPLIED MATERIALS INC1 citations60
US10170321B2Jan 1, 2019

Aluminum content control of TiAIN films

APPLIED MATERIALS INC1 citations60
US12592369B2Mar 31, 2026

Integrated method and tool for high quality selective silicon nitride deposition

APPLIED MATERIALS INC0 citations52
US10665450B2May 26, 2020

Methods and apparatus for doping engineering and threshold voltage tuning by integrated deposition of titanium nitride and aluminum films

APPLIED MATERIALS INC0 citations52
US7119571B2Oct 10, 2006

Test structure design for reliability test

APPLIED MATERIALS INC0 citations52
US10553425B2Feb 4, 2020

Self-limiting and saturating chemical vapor deposition of a silicon bilayer and ALD

APPLIED MATERIALS INC0 citations51
US9773663B2Sep 26, 2017

Self-limiting and saturating chemical vapor deposition of a silicon bilayer and ALD

APPLIED MATERIALS INC0 citations51
US8349741B2Jan 8, 2013

Amorphous carbon deposition method for improved stack defectivity

APPLIED MATERIALS INC0 citations51
US6593252B1Jul 15, 2003

Film deposition method and apparatus

APPLIED MATERIALS INC0 citations51
US12062545B2Aug 13, 2024

Fluorine-free tungsten ALD for dielectric selectivity improvement

APPLIED MATERIALS INC0 citations49

BABCOCK HITACHI KK

4 patents

VARIAN SEMICONDUCTOR EQUIPMENT ASS INC

2 patents

YOSHIDA NAOMI

1 patent

YU HANG

1 patent

FREUNT IND CO LTD

1 patent

UNIV CALIFORNIA

1 patent

AKIZUKI NAOMICHI

1 patent

Showing the top 50 of 52 patents by PatentIndex Score.