Inventor
KANG SUNG-IL
KR22 patents
⚠️ This page may combine multiple inventors who share the name “KANG SUNG-IL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HAESUNG DS CO LTD
9 patentsUS9460986B2Oct 4, 2016
Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same
HAESUNG DS CO LTD3 citations66
US10910299B2Feb 2, 2021
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the method
HAESUNG DS CO LTD1 citations61
US11876012B2Jan 16, 2024
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
HAESUNG DS CO LTD0 citations57
US12341086B2Jun 24, 2025
Lead frame
HAESUNG DS CO LTD0 citations54
US11227775B2Jan 18, 2022
Method of fabricating carrier for wafer level package by using lead frame
HAESUNG DS CO LTD0 citations54
US11854830B2Dec 26, 2023
Method of manufacturing circuit board
HAESUNG DS CO LTD0 citations50
US10840170B2Nov 17, 2020
Semiconductor package substrate and method for manufacturing same
HAESUNG DS CO LTD0 citations50
US10643933B2May 5, 2020
Semiconductor package substrate and manufacturing method therefor
HAESUNG DS CO LTD0 citations50
US10643932B2May 5, 2020
Semiconductor package substrate and method for manufacturing same
HAESUNG DS CO LTD0 citations50
SAMSUNG ELECTRONICS CO LTD
4 patentsUS6611886B1Aug 26, 2003
Method for transferring variable isochronous data and apparatus therefor
SAMSUNG ELECTRONICS CO LTD19 citations91
US7454539B2Nov 18, 2008
Method for transferring variable isochronous data and apparatus therefore
SAMSUNG ELECTRONICS CO LTD5 citations72
US7155543B2Dec 26, 2006
Method for transferring variable isochronous data and apparatus therefor
SAMSUNG ELECTRONICS CO LTD9 citations72
US6667987B1Dec 23, 2003
Method of extending channels for IEEE-1394 serial bus
SAMSUNG ELECTRONICS CO LTD12 citations66
SAMSUNG TECHWIN CO LTD
3 patentsUS6475646B2Nov 5, 2002
Lead frame and method of manufacturing the lead frame
SAMSUNG TECHWIN CO LTD67 citations94
US7285845B2Oct 23, 2007
Lead frame for semiconductor package
SAMSUNG TECHWIN CO LTD10 citations82
US8354741B2Jan 15, 2013
Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package
SAMSUNG TECHWIN CO LTD5 citations70