Inventor · disambiguated record
Senol Pekin
Also filed as: PEKIN SENOL
5 granted patents·1 pending application·64 citations·filing 2000–2004
80Inventor score
Files withLSI LOGIC CORP5
Top patents by PatentIndex Score
6 records- 0173US6466038B1Non-isothermal electromigration testing of microelectronic packaging interconnectsLSI LOGIC CORP·Filed 2000·Granted Oct 15, 2002·19 cites·17 claims
- 0267US6700207B2Flip-chip ball grid array package for electromigration testingLSI LOGIC CORP·Filed 2002·Granted Mar 2, 2004·18 cites·14 claims
- 0366US6818996B2Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumpsLSI LOGIC CORP·Filed 2002·Granted Nov 16, 2004·12 cites·18 claims
- 0463US7065721B2Optimized bond out method for flip chip wafersLSI LOGIC CORP·Filed 2004·Granted Jun 20, 2006·13 cites·25 claims
- 0539US2005017368A1Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumpsFiled 2004·Application pending·0 cites
- 0636US6403399B1Method of rapid wafer bumpingLSI LOGIC CORP·Filed 2000·Granted Jun 11, 2002·2 cites·9 claims
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