Inventor · disambiguated record
Ho-Jeong Moon
Also filed as: MOON HO-JEONG
8 granted patents·4 pending applications·49 citations·filing 2001–2020
85Inventor score
Top patents by PatentIndex Score
12 records- 0174US6756668B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 29, 2004·19 cites·15 claims
- 0269US6638638B2Hollow solder structure having improved reliability and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 28, 2003·11 cites·13 claims
- 0367US9728293B2X-ray system, semiconductor package, and tray having X-ray absorption filterKIM SANG-YOUNG·Filed 2014·Granted Aug 8, 2017·2 cites·14 claims
- 0463US11217495B2X-ray system, semiconductor package, and tray having X-ray absorption filterSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·16 claims
- 0560US8448506B2Adhesion test method using elastic plateYOON YEO-HOON·Filed 2010·Granted May 28, 2013·2 cites·17 claims
- 0655US7692291B2Circuit board having a heating means and a hermetically sealed multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 6, 2010·7 cites·19 claims
- 0753US6963033B2Ball grid array attaching means having improved reliability and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 8, 2005·4 cites·36 claims
- 0852US7081375B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 25, 2006·4 cites·8 claims
- 0947US2017301591A1X-ray system, semiconductor package, and tray having x-ray absorption filterSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1039US2009146300A1Semiconductor packages and electronic products employing the sameYANG SE-YOUNG·Filed 2008·Application pending·0 cites
- 1137US2004163843A1Multi-chip package with soft element and method of manufacturing the sameFiled 2004·Application pending·0 cites
- 1234US2010177165A1Method of conducting preconditioned reliability test of semiconductor package using convection and 3-d imagingSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →