Inventor
MYUNG JUNWOO
KR16 patents
⚠️ This page may combine multiple inventors who share the name “MYUNG JUNWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YEE JAE HAK
4 patentsUS8501540B2Aug 6, 2013
Method for manufacture of inline integrated circuit system
YEE JAE HAK4 citations61
US8937372B2Jan 20, 2015
Integrated circuit package system with molded strip protrusion
YEE JAE HAK0 citations51
US8810019B2Aug 19, 2014
Integrated circuit package system with stacked die
YEE JAE HAK0 citations50
US8138591B2Mar 20, 2012
Integrated circuit package system with stacked die
YEE JAE HAK0 citations50
CHI HEEJO
3 patentsUS9735113B2Aug 15, 2017
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
CHI HEEJO60 citations97
US8421210B2Apr 16, 2013
Integrated circuit packaging system with dual side connection and method of manufacture thereof
CHI HEEJO9 citations83
US8710634B2Apr 29, 2014
Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
CHI HEEJO6 citations71
STATS CHIPPAC LTD
3 patentsUS7871861B2Jan 18, 2011
Stacked integrated circuit package system with intra-stack encapsulation
STATS CHIPPAC LTD22 citations92
US7968981B2Jun 28, 2011
Inline integrated circuit system
STATS CHIPPAC LTD8 citations83
US7859120B2Dec 28, 2010
Package system incorporating a flip-chip assembly
STATS CHIPPAC LTD11 citations83
SAMSUNG ELECTRONICS CO LTD
3 patentsUS12154840B2Nov 26, 2024
Semiconductor device and semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11670568B2Jun 6, 2023
Semiconductor device and semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11088060B2Aug 10, 2021
Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package
SAMSUNG ELECTRONICS CO LTD0 citations48