Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an integrated circuit above and to the substrate; mounting an internal interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate and over the integrated circuit with the integral-interposer-structure connected to the internal interconnect; and encapsulating the internal interconnect and the integrated circuit with an encapsulation.

What is claimed is: 
     
       1. A method of manufacture of an integrated circuit packaging system comprising:
 providing a substrate having a plurality of substrate-interconnects; 
 mounting a plurality of internal interconnects to and over the plurality of substrate-interconnects; 
 mounting an integrated circuit above the substrate and the plurality of substrate-interconnects, the integrated circuit adjacent to and between the plurality of internal interconnects; 
 mounting an interposer having an integral-interposer-structure over the substrate, the plurality of substrate-interconnects, the integrated circuit and the plurality of internal interconnects, the integral-interposer-structure extending past peripheral sides of the integrated circuit and electrically connected to the plurality of internal interconnects, wherein mounting the interposer includes mounting an integral-conductive-shield having a hole; 
 embedding a die in the integral-interposer-structure between a top surface and a bottom surface of the integral-interposer-structure; and 
 forming an encapsulation encapsulating the plurality of internal interconnects and the integrated circuit. 
 
     
     
       2. The method as claimed in  claim 1  wherein mounting the plurality of internal interconnects includes mounting each of the plurality of internal interconnects having a stand-off-height from the integrated circuit to the integral-conductive-shield. 
     
     
       3. The method as claimed in  claim 1  wherein mounting the interposer further includes forming a grounding path from the integral-conductive shield through the plurality of internal interconnects, with the grounding path extending over and across the integrated circuit. 
     
     
       4. The method as claimed in  claim 1  further comprising:
 mounting an external interconnect to and under each of the plurality of substrate-interconnects. 
 
     
     
       5. The method as claimed in  claim 1  wherein mounting the integrated circuit includes mounting a flip-chip. 
     
     
       6. The method as claimed in  claim 1  further comprising
 mounting a passive component between the substrate and the integral-interposer-structure. 
 
     
     
       7. An integrated circuit packaging system comprising:
 a substrate having a plurality of substrate-interconnects; 
 a plurality of internal interconnects mounted to and over the plurality of substrate-interconnects; 
 an integrated circuit mounted above the substrate and the plurality of substrate-interconnects, the integrated circuit adjacent to and between the plurality of internal interconnects; 
 an interposer having an integral-interposer-structure mounted over the substrate, the plurality of substrate-interconnects, the integrated circuit and the plurality of internal interconnects, the integral-interposer-structure extending past peripheral sides of the integrated circuit and electrically connected to the plurality of internal interconnects, the integral-interposer-structure having a die embedded in the integral-interposer-structure between a top surface and a bottom surface of the integral-interposer-structure, wherein the integral-interposer-structure is an integral-conductive-shield having a hole; and 
 an encapsulation encapsulating the plurality of internal interconnects and the integrated circuit. 
 
     
     
       8. The system as claimed in  claim 7  wherein each of the plurality of internal interconnects includes a stand-off-height from the integrated circuit to the integral-conductive-shield. 
     
     
       9. The system as claimed in  claim 7  further comprising a ground path from the integral-conductive shield through the plurality of internal interconnects with the ground path extending over and across the integrated circuit. 
     
     
       10. The system as claimed in  claim 7  further comprising:
 an external interconnect mounted to each of the plurality of substrate-interconnects. 
 
     
     
       11. The system as claimed in  claim 7  wherein the integrated circuit is a flip-chip. 
     
     
       12. The system as claimed in  claim 7  further comprising a passive component mounted above the substrate and under the integral-interposer-structure.