Inventor · disambiguated record
Hyungmin Lee
Also filed as: LEE HYUNGMIN
35 granted patents·14 pending applications·215 citations·filing 2009–2025
96Inventor score
Top patents by PatentIndex Score
49 records- 0198US8008121B2Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrateSTATS CHIPPAC LTD·Filed 2009·Granted Aug 30, 2011·105 cites·13 claims
- 0294US8357564B2Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor dieSTATS CHIPPAC LTD·Filed 2010·Granted Jan 22, 2013·21 cites·25 claims
- 0391US11739437B2Resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growthGLOBALWAFERS CO LTD·Filed 2019·Granted Aug 29, 2023·2 cites·17 claims
- 0490US9190297B2Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structuresCHOI DAESIK·Filed 2011·Granted Nov 17, 2015·14 cites·36 claims
- 0589US11142844B2High resistivity single crystal silicon ingot and wafer having improved mechanical strengthGLOBALWAFERS CO LTD·Filed 2017·Granted Oct 12, 2021·5 cites·45 claims
- 0689US8648469B2Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrateCHOI DAESIK·Filed 2011·Granted Feb 11, 2014·8 cites·26 claims
- 0788US9951440B2Methods for producing low oxygen silicon ingotsSUNEDISON SEMICONDUCTOR LTD·Filed 2014·Granted Apr 24, 2018·3 cites·35 claims
- 0888US9391046B2Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor waferPARK YEONGLM·Filed 2011·Granted Jul 12, 2016·23 cites·25 claims
- 0987US10793969B2Sample rod growth and resistivity measurement during single crystal silicon ingot productionGLOBAL WAFERS CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·18 claims
- 1085US10513796B2Methods for producing low oxygen silicon ingotsGLOBALWAFERS CO LTD·Filed 2018·Granted Dec 24, 2019·1 cites·31 claims
- 1184US10920337B2Methods for forming single crystal silicon ingots with improved resistivity controlSUNEDISON SEMICONDUCTOR LTD·Filed 2017·Granted Feb 16, 2021·1 cites·14 claims
- 1283US10781532B2Methods for determining the resistivity of a polycrystalline silicon meltGLOBAL WAFERS CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·19 claims
- 1382US9305897B2Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrateSTATS CHIPPAC LTD·Filed 2013·Granted Apr 5, 2016·4 cites·24 claims
- 1482US9153476B2Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Oct 6, 2015·5 cites·25 claims
- 1579US12351938B2Methods for producing a product ingot having low oxygen contentGLOBALWAFERS CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·14 claims
- 1679US2023340690A1Resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growthGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 1778US8710668B2Integrated circuit packaging system with laser hole and method of manufacture thereofLEE HYUNGMIN·Filed 2011·Granted Apr 29, 2014·7 cites·18 claims
- 1877US12212242B2DC-to-DC converter and integrated circuit including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1974US11308326B2Electronic apparatus and controlling method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 19, 2022·1 cites·18 claims
- 2074US2025270733A1Methods for producing a product ingot having low oxygen contentGLOBALWAFERS CO LTD·Filed 2025·Application pending·0 cites
- 2173US9594473B2Sound visualization method and apparatus of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 14, 2017·5 cites·20 claims
- 2272US11655560B2High resistivity single crystal silicon ingot and wafer having improved mechanical strengthGLOBALWAFERS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·30 claims
- 2372US11655559B2High resistivity single crystal silicon ingot and wafer having improved mechanical strengthGLOBALWAFERS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·27 claims
- 2472US8710634B2Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Apr 29, 2014·6 cites·12 claims
- 2569US12024789B2Methods for forming single crystal silicon ingots with improved resistivity controlGLOBALWAFERS CO LTD·Filed 2020·Granted Jul 2, 2024·0 cites·7 claims
- 2668US11804778B2DC-to-DC converter and integrated circuit including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 2764US12334823B2DC-DC buck converter and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2862US12283884B2DC-DC converter and power device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·10 claims
- 2962US11763690B2Electronic apparatus and controlling method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·18 claims
- 3058US2025130682A1Electronic device including light emitter and method for controlling sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3156US12430676B2Method and electronic device for recognizing productSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·19 claims
- 3256US2025139214A1Method for performing authentication using fingerprint sensor and electronic device supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3353US2025118235A1Electronic device and method for partially controlling brightness of flexible display on basis of shape of flexible displaySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3452US11196344B2Power switching circuit, a DC-DC converter including the same and a voltage conversion methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·19 claims
- 3552US2025201159A1Electronic device including flexible display and method for controlling sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3651US11775566B2Electronic device and method for controlling the electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·17 claims
- 3749US2020199773A1Center Slab Lapping and Resistivity Measurement During Single Crystal Silicon Ingot ProductionGLOBALWAFERS CO LTD·Filed 2018·Application pending·0 cites
- 3849US2020199775A1Sample Rod Center Slab Resistivity Measurement During Single Crystal Silicon Ingot ProductionGLOBALWAFERS CO LTD·Filed 2018·Application pending·0 cites
- 3949US2020199774A1Sample Rod Center Slab Resistivity Measurement With Four-Point Probe During Single Crystal Silicon Ingot ProductionGLOBALWAFERS CO LTD·Filed 2018·Application pending·0 cites
- 4049US2025148949A1Electronic device for displaying screen in display area of deformable display, and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4148US8426955B2Integrated circuit packaging system with a stack package and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Apr 23, 2013·0 cites·18 claims
- 4248US2023206665A1Method and electronic device for recognizing text in imageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4343US12033252B2Electronic device and method for controlling application thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 9, 2024·0 cites·12 claims
- 4442US9898096B2Electronic device and method of controlling display of screen thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 20, 2018·0 cites·22 claims
- 4538US2013075923A1Integrated circuit packaging system with encapsulation and method of manufacture thereofPARK YEONGIM·Filed 2011·Application pending·0 cites
- 4637US10043488B2Electronic device and method of controlling display thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·13 claims
- 4736US2016048316A1Electronic device and method for providing user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 4833USD853398SElectronic cover with light animationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 9, 2019·1 cites·1 claims
- 4933US2012326324A1Integrated circuit packaging system with package stacking and method of manufacture thereofLEE HYUNGMIN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →