Inventor · disambiguated record
Yeonglm Park
Also filed as: PARK YEONGLM
2 granted patents·29 citations·filing 2009–2011
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0188US9391046B2Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor waferPARK YEONGLM·Filed 2011·Granted Jul 12, 2016·23 cites·25 claims
- 0272US8710634B2Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Apr 29, 2014·6 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →