Inventor
JENG KEVIN
US5 patents
Patents
5 patentsUS7314819B2Jan 1, 2008
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
INTEL CORP15 citations92
US6265300B1Jul 24, 2001
Wire bonding surface and bonding method
INTEL CORP35 citations89
US5567981AOct 22, 1996
Bonding pad structure having an interposed rigid layer
INTEL CORP40 citations89
US7960831B2Jun 14, 2011
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
INTEL CORP7 citations83
US7056817B2Jun 6, 2006
Forming a cap above a metal layer
INTEL CORP0 citations49