Inventor
MATSUDA SHUICHI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “MATSUDA SHUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
9 patentsUS5322748AJun 21, 1994
Photomask and a method of manufacturing thereof comprising trapezoidal shaped light blockers covered by a transparent layer
MITSUBISHI ELECTRIC CORP22 citations92
US4876164AOct 24, 1989
Process for manufacturing a photomask
MITSUBISHI ELECTRIC CORP16 citations82
US4985319AJan 15, 1991
Process for manufacturing a photomask
MITSUBISHI ELECTRIC CORP10 citations73
US4957834ASep 18, 1990
Method for manufacturing photomask
MITSUBISHI ELECTRIC CORP12 citations73
US4792461ADec 20, 1988
Method of forming a photomask material
MITSUBISHI ELECTRIC CORP9 citations73
US4783371ANov 8, 1988
Photomask material
MITSUBISHI ELECTRIC CORP9 citations73
US4717625AJan 5, 1988
Photomask material
MITSUBISHI ELECTRIC CORP12 citations73
US4738907AApr 19, 1988
Process for manufacturing a photomask
MITSUBISHI ELECTRIC CORP14 citations70
US4661426AApr 28, 1987
Process for manufacturing metal silicide photomask
MITSUBISHI ELECTRIC CORP15 citations70
NEC CORP
8 patentsUS5897337AApr 27, 1999
Process for adhesively bonding a semiconductor chip to a carrier film
NEC CORP182 citations99
US5726489AMar 10, 1998
Film carrier semiconductor device
NEC CORP95 citations98
US5757078AMay 26, 1998
Semiconductor device with increased multi-bumps and adhered multilayered insulating films and method for installing same
NEC CORP155 citations97
US5683942ANov 4, 1997
Method for manufacturing bump leaded film carrier type semiconductor device
NEC CORP133 citations97
US5905303AMay 18, 1999
Method for manufacturing bump leaded film carrier type semiconductor device
NEC CORP77 citations95
US5759873AJun 2, 1998
Method of manufacturing chip-size package-type semiconductor device
NEC CORP63 citations94
US6339337B1Jan 15, 2002
Method for inspecting semiconductor chip bonding pads using infrared rays
NEC CORP26 citations92
US5757068AMay 26, 1998
Carrier film with peripheral slits
NEC CORP25 citations92
NEC ELECTRONICS CORP
3 patentsUS7084511B2Aug 1, 2006
Semiconductor device having resin-sealed area on circuit board thereof
NEC ELECTRONICS CORP13 citations84
US6794750B2Sep 21, 2004
Semiconductor device
NEC ELECTRONICS CORP10 citations74
US7268439B2Sep 11, 2007
Semiconductor device having resin-sealed area on circuit board thereof
NEC ELECTRONICS CORP0 citations52