Inventor
HALL FRANK L
US18 patents
⚠️ This page may combine multiple inventors who share the name “HALL FRANK L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
17 patentsUS7485971B2Feb 3, 2009
Electronic device package
MICRON TECHNOLOGY INC12 citations92
US7276802B2Oct 2, 2007
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC21 citations92
US7268067B2Sep 11, 2007
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC21 citations92
US7262074B2Aug 28, 2007
Methods of fabricating underfilled, encapsulated semiconductor die assemblies
MICRON TECHNOLOGY INC21 citations92
US7084515B2Aug 1, 2006
Electronic device package
MICRON TECHNOLOGY INC21 citations92
US6987058B2Jan 17, 2006
Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material
MICRON TECHNOLOGY INC30 citations92
US6969914B2Nov 29, 2005
Electronic device package
MICRON TECHNOLOGY INC29 citations92
US6835592B2Dec 28, 2004
Methods for molding a semiconductor die package with enhanced thermal conductivity
MICRON TECHNOLOGY INC21 citations92
US7642643B2Jan 5, 2010
Apparatus for molding a semiconductor die package with enhanced thermal conductivity
MICRON TECHNOLOGY INC8 citations84
US7498606B2Mar 3, 2009
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
MICRON TECHNOLOGY INC9 citations84
US7364934B2Apr 29, 2008
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
MICRON TECHNOLOGY INC9 citations84
US7468559B2Dec 23, 2008
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC5 citations73
US7851907B2Dec 14, 2010
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC2 citations62
US7342319B2Mar 11, 2008
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC3 citations62
US7116000B2Oct 3, 2006
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication
MICRON TECHNOLOGY INC4 citations62
US7416913B2Aug 26, 2008
Methods of manufacturing microelectronic imaging units with discrete standoffs
MICRON TECHNOLOGY INC1 citations52
US7417294B2Aug 26, 2008
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
MICRON TECHNOLOGY INC0 citations52