US6969914B2ExpiredUtilityPatentIndex 92
Electronic device package

Assignee: MICRON TECHNOLOGY INCPriority: Aug 29, 2002Filed: Aug 29, 2002Granted: Nov 29, 2005
Est. expiryAug 29, 2022(expired)· nominal 20-yr term from priority
Inventors:FULLER JASON L HALL FRANK L JIANG TONGBI
H10W 74/00H10W 90/291H10W 90/231H10W 90/20H10W 90/724H10W 72/884H10W 72/879H10W 72/865H10W 72/856H10W 72/536H10W 90/754H10W 72/9445H10W 72/29H10W 90/00H10W 72/013H10W 72/075H10W 72/07337H10W 72/073H10W 72/07327H10W 72/354H10W 72/20H10W 72/07251H10W 90/734H10W 90/732H10W 90/701H10W 70/415H10W 74/117H10W 74/15H10W 74/012H10W 70/68
PatentIndex Score
Cited by
References
115
Claims
Abstract

An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.
Claims

exact text as granted — not AI-modified
1. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin having oxiranes; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       2. The integrated circuit package of  claim 1 , wherein the plurality of adhesive bumps includes a high viscosity adhesive material. 
     
     
       3. The integrated circuit package of  claim 1  wherein the epoxy resin is formed from oxiranes that are identical. 
     
     
       4. The integrated circuit package of  claim 1  wherein the epoxy resin is formed from oxiranes that are not identical. 
     
     
       5. The integrated circuit package of  claim 1  wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 1,000. 
     
     
       6. The integrated circuit package of  claim 1  wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 100. 
     
     
       7. The integrated circuit package of  claim 1  wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 10. 
     
     
       8. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin is a mixture of two or more epoxy resins; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       9. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin is a mixture of 2 to about 100 epoxy resins; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       10. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin is a mixture of 2 to about 50 epoxy resins; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       11. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin is a mixture of 2 to about 10 epoxy resins; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       12. The integrated circuit package of  claim 1  wherein the epoxy resin is polymerized from one or more oxiranes under basic conditions. 
     
     
       13. The integrated circuit package of  claim 1  wherein the epoxy resin is polymerized from one or more oxiranes under acidic conditions. 
     
     
       14. The integrated circuit package of  claim 1  wherein the epoxy resin is polymerized from one or more oxiranes under basic or acidic conditions and further includes a solidifier, a catalyst, or a combination thereof. 
     
     
       15. The integrated circuit package of  claim 1  wherein the epoxy resin is polymerized from one or more oxiranes under basic or acidic conditions and further includes bisphenol A, bisphenol F, methyl hexahydrophthalic anhydride, silica, carbon black, CTBN or a combination thereof. 
     
     
       16. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin comprises about 2 to about 1,000,000 monomers formed from the oxirane; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       17. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin comprises about 2 to about 100,000 monomers formed from the oxirane; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       18. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin comprises about 2 to about 50,000 monomers formed from the oxirane; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       19. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin, wherein the epoxy resin comprises about 2 to about 10,000 monomers formed from the oxirane; and  
 a die on the plurality of adhesive bumps.  
 
     
     
       20. The integrated circuit package of  claim 1  wherein the epoxy resin is formed at room temperature. 
     
     
       21. The integrated circuit package of  claim 1  wherein the epoxy resin is formed at an elevated temperature. 
     
     
       22. The integrated circuit package of  claim 1  wherein the epoxy resin is formed at a temperature above about 77° F. (25° C.). 
     
     
       23. The integrated circuit package of  claim 1  wherein the epoxy resin is formed at a pressure above about 1 atm. (14.7 psi). 
     
     
       24. The integrated circuit package of  claim 1  wherein the epoxy resin is formed via the use of radiant energy. 
     
     
       25. The integrated circuit package of  claim 1  wherein the epoxy resin is formed via the use of UV, electron beam, microwave, beta radiation, gamma radiation, neutron beam, proton beam, infra red, or a combination thereof. 
     
     
       26. The integrated circuit package of  claim 1 , wherein the substrate includes a printed circuit board. 
     
     
       27. The integrated circuit package of  claim 1 , wherein the substrate includes a glass-epoxy resin substrate. 
     
     
       28. The integrated circuit package of  claim 1 , wherein the die includes a memory circuit. 
     
     
       29. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps; and  
 wherein the plurality of adhesive bumps contact less than about 30% of the surface area of the die.  
 
     
     
       30. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps; and  
 wherein the plurality of adhesive bumps contact less than about 50% of the surface area of the die.  
 
     
     
       31. The integrated circuit package of  claim 1 , wherein the plurality of adhesive bumps stand upright from a surface of the substrate and separate the die from the substrate. 
     
     
       32. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin having oxiranes;  
 a die on the plurality of adhesive bumps and spaced from the substrate; and  
 an underfill material in the space between the substrate and the die.  
 
     
     
       33. The integrated circuit package of  claim 32 , wherein the plurality of adhesive bumps includes a high viscosity adhesive material. 
     
     
       34. The integrated circuit package of  claim 32 , wherein the underfill material includes a epoxy encapsulant. 
     
     
       35. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps and spaced from the substrate; and  
 an underfill material in the space between the substrate and the die, wherein the underfill material has a lower viscosity than the plurality of adhesive bumps.  
 
     
     
       36. The integrated circuit package of  claim 35 , wherein the underfill material has a viscosity of about 2,800 mPa s. 
     
     
       37. The integrated circuit package of  claim 32 , wherein the substrate includes a first surface, the die includes a second surface, the first surface faces the second surface, and wherein the underfill material contacts both the first surface and the second surface. 
     
     
       38. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps and spaced from the substrate; and  
 an underfill material in the space between the substrate and the die, wherein the plurality of adhesive bumps have a Young&#39;s modulus, and wherein the underfill material includes a Young&#39;s modulus that is an order of magnitude greater than the Young&#39;s modulus of the plurality of adhesive bumps.  
 
     
     
       39. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps and spaced from the substrate;  
 an underfill material in the space between the substrate and the die, wherein the underfill material cross-links to the plurality of adhesive bumps; and  
 wherein the underfill material has a lower viscosity than the plurality of adhesive bumps.  
 
     
     
       40. The integrated circuit package of  claim 39 , wherein the underfill material has a viscosity of about 2,800 mPa s. 
     
     
       41. The integrated circuit package of  claim 39 , wherein the adhesive bumps include an epoxy resin. 
     
     
       42. An integrated circuit package comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate, wherein the plurality of adhesive bumps includes an epoxy resin having oxiranes;  
 a die on the plurality of adhesive bumps and spaced from the substrate; and  
 an underfill material in the space between the substrate and the die, wherein the underfill material connects to the plurality of adhesive bumps to form a continuous material layer between the substrate and the die.  
 
     
     
       43. The integrated circuit package of  claim 42 , wherein the underfill material includes an epoxy resin. 
     
     
       44. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps and spaced from the substrate;  
 an underfill material in the space between the substrate and the die, wherein the underfill material connects to the plurality of adhesive bumps to form a continuous material layer between the substrate and the die; and  
 wherein the underfill material has a lower viscosity than the plurality of adhesive bumps.  
 
     
     
       45. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps and spaced from the substrate;  
 an underfill material in the space between the substrate and the die, wherein the underfill material connects to the plurality of adhesive bumps to form a continuous material layer between the substrate and the die; and  
 wherein the underfill material has a viscosity of about 2,800 mPa s.  
 
     
     
       46. An electronic device package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps and spaced from the substrate;  
 an underfill material in the space between the substrate and the die, wherein the underfill material has a lower viscosity than the plurality of adhesive bumps;  
 an electrical connection between the die and the substrate; and  
 wherein the plurality of adhesive bumps contact less than about 50% of the surface area of the die.  
 
     
     
       47. The package of  claim 46 , wherein the underfill material connects to the plurality of adhesive bumps to form a continuous material layer between the substrate and the die. 
     
     
       48. The package of  claim 46 , wherein the underfill material cross-links to the plurality of adhesive bumps to form a continuous material layer between the substrate and the die. 
     
     
       49. The package of  claim 46 , wherein the adhesive bumps extend upwardly from the substrate first surface to space the die from the substrate first surface. 
     
     
       50. The package of  claim 46 , wherein the electrical connection includes at least one wire bond. 
     
     
       51. The package of  claim 46 , wherein the underfill material and the adhesive bumps include an epoxy resin. 
     
     
       52. An electronic package, comprising:
 a substrate having a first surface, a second surface, and a first contact;  
 a plurality of adhesive bumps on the substrate first surface;  
 a die on the plurality of adhesive bumps and spaced from the substrate, the die including a first surface opposing the substrate first surface, a second surface, and a second contact;  
 an underfill material in the space between the substrate first surface and the die first surface, wherein the underfill material has a lower viscosity than the plurality of adhesive bumps;  
 an electrical connection between the first contact and the second contact; and  
 wherein the plurality of adhesive bumps contact less than about 30% of the surface area of the die.  
 
     
     
       53. The package of  claim 52 , wherein the underfill material cross-links to the plurality of adhesive bumps to form a continuous material layer between the substrate and the die. 
     
     
       54. The package of  claim 52 , wherein the adhesive bumps extend upwardly from the substrate first surface to space the die from the substrate first surface. 
     
     
       55. The package of  claim 52 , wherein the electrical connection includes at least one wire bond. 
     
     
       56. The package of  claim 52 , wherein the underfill material and the adhesive bumps include an epoxy resin. 
     
     
       57. The package of  claim 52 , wherein the substrate includes a slot, and the electrical connection extends through the slot. 
     
     
       58. The package of  claim 52 , wherein the first contact is on the substrate second surface, and wherein the second contact is on the die first surface. 
     
     
       59. The package of  claim 58 , wherein the electrical connection includes a wire bond. 
     
     
       60. The package of  claim 52 , wherein the first contact is on the substrate first surface, and wherein the second contact is on the die second surface. 
     
     
       61. The package of  claim 60 , wherein the electrical connection includes a wire bond. 
     
     
       62. An integrated circuit package, comprising:
 a substrate;  
 a plurality of adhesive bumps on the substrate;  
 a die on the plurality of adhesive bumps and spaced from the substrate;  
 an underfill material in the space between the substrate and the die; and  
 wherein the underfill material includes 1,6-Bis(2,3-epoxypropoxy) naphthalene; methyl hexahydrophthalic anhydride; silica; and carbon black.  
 
     
     
       63. The integrated circuit package of  claim 8 , wherein the epoxy resin is formed at an elevated temperature. 
     
     
       64. The integrated circuit package of  claim 8 , wherein the epoxy resin is formed at a temperature above about 77° F. (25° C.). 
     
     
       65. The integrated circuit package of  claim 64 , wherein the epoxy resin is formed at a pressure above about 1 atm. (14.7 psi). 
     
     
       66. The integrated circuit package of  claim 8 , wherein the epoxy resin is formed from oxiranes that are identical. 
     
     
       67. The integrated circuit package of  claim 8 , wherein the epoxy resin is formed from oxiranes that are not identical. 
     
     
       68. The integrated circuit package of  claim 8 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 1,000. 
     
     
       69. The integrated circuit package of  claim 8 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 100. 
     
     
       70. The integrated circuit package of  claim 8 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 10. 
     
     
       71. The integrated circuit package of  claim 8 , wherein the plurality of adhesive bumps contact less than about 30% of the surface area of the die. 
     
     
       72. The integrated circuit package of  claim 8 , wherein the plurality of adhesive bumps contact less than about 50% of the surface area of the die. 
     
     
       73. The integrated circuit package of  claim 9 , wherein the epoxy resin is formed at an elevated temperature. 
     
     
       74. The integrated circuit package of  claim 9 , wherein the epoxy resin is formed at a temperature above about 77° F. (25° C.). 
     
     
       75. The integrated circuit package of  claim 74 , wherein the epoxy resin is formed at a pressure above about 1 atm. (14.7 psi). 
     
     
       76. The integrated circuit package of  claim 9 , wherein the epoxy resin is formed from oxiranes that are identical. 
     
     
       77. The integrated circuit package of  claim 9 , wherein the epoxy resin is formed from oxiranes that are not identical. 
     
     
       78. The integrated circuit package of  claim 9 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 1,000. 
     
     
       79. The integrated circuit package of  claim 9 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 100. 
     
     
       80. The integrated circuit package of  claim 9 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 10. 
     
     
       81. The integrated circuit package of  claim 9 , wherein the plurality of adhesive bumps contact less than about 30% of the surface area of the die. 
     
     
       82. The integrated circuit package of  claim 9 , wherein the plurality of adhesive bumps contact less than about 50% of the surface area of the die. 
     
     
       83. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed at an elevated temperature. 
     
     
       84. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed at a temperature above about 77° F. (25° C.). 
     
     
       85. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed at a pressure above about 1 atm. (14.7 psi). 
     
     
       86. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed from oxiranes that are identical. 
     
     
       87. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed from oxiranes that are not identical. 
     
     
       88. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 1,000. 
     
     
       89. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 100. 
     
     
       90. The integrated circuit package of  claim 10 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 10. 
     
     
       91. The integrated circuit package of  claim 10 , wherein the plurality of adhesive bumps contact less than about 30% of the surface area of the die. 
     
     
       92. The integrated circuit package of  claim 10 , wherein the plurality of adhesive bumps contact less than about 50% of the surface area of the die. 
     
     
       93. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed at an elevated temperature. 
     
     
       94. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed at a temperature above about 77° F. (25° C.). 
     
     
       95. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed at a pressure above about 1 atm. (14.7 psi). 
     
     
       96. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed from oxiranes that are identical. 
     
     
       97. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed from oxiranes that are not identical. 
     
     
       98. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 1,000. 
     
     
       99. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 100. 
     
     
       100. The integrated circuit package of  claim 11 , wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 10. 
     
     
       101. The integrated circuit package of  claim 11 , wherein the plurality of adhesive bumps contact less than about 30% of the surface area of the die. 
     
     
       102. The integrated circuit package of  claim 11 , wherein the plurality of adhesive bumps contact less than about 50% of the surface area of the die. 
     
     
       103. The integrated circuit package of  claim 35 , wherein the plurality of adhesive bumps includes a high viscosity adhesive material. 
     
     
       104. The integrated circuit package of  claim 35 , wherein the underfill material includes a epoxy encapsulant. 
     
     
       105. The integrated circuit package of  claim 35 , wherein the substrate includes a first surface, the die includes a second surface, the first surface faces the second surface, and wherein the underfill material contacts both the first surface and the second surface. 
     
     
       106. The integrated circuit package of  claim 35 , wherein the plurality of adhesive bumps have a Young&#39;s modulus, and wherein the underfill material includes a Young&#39;s modulus that is an order of magnitude greater than the Young&#39;s modulus of the plurality of adhesive bumps. 
     
     
       107. The integrated circuit package of  claim 29 , wherein the die includes a memory circuit. 
     
     
       108. The integrated circuit package of  claim 107 , wherein the memory circuit include a random access memory device. 
     
     
       109. The integrated circuit package of  claim 62 , wherein the underfill material has a lower viscosity than the plurality of adhesive bumps. 
     
     
       110. The integrated circuit package of  claim 62 , wherein the underfill material has a viscosity of about 2,800 mPa s. 
     
     
       111. The integrated circuit package of  claim 62 , wherein the plurality of adhesive bumps have a Young&#39;s modulus, and wherein the underfill material includes a Young&#39;s modulus that is an order of magnitude greater than the Young&#39;s modulus of the plurality of adhesive bumps. 
     
     
       112. The integrated circuit package of  claim 62 , wherein the plurality of adhesive bumps contact less than about 30% of the surface area of the die. 
     
     
       113. The integrated circuit package of  claim 62 , wherein the plurality of adhesive bumps contact less than about 50% of the surface area of the die. 
     
     
       114. The integrated circuit package of  claim 62 , wherein the substrate includes a glass-epoxy resin substrate. 
     
     
       115. The package of  claim 46 , wherein the underfill material includes 1,6-Bis(2,3-epoxypropoxy) naphthalene; methyl hexahydrophthalic anhydride; silica; and carbon black.
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