Inventor

TAN HIEN BOON

SG18 patents

⚠️ This page may combine multiple inventors who share the name “TAN HIEN BOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAN HIEN BOON

UNITED TEST & ASSEMBLY CT LTD

Leadframe enhancement and method of producing a multi-row semiconductor package

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Cavity chip package

High density chip scale leadframe package and method of manufacturing the package

Stacked die packages

Structurally-enhanced integrated circuit package and method of manufacture

Multi-die IC package and manufacturing method

Leadframe enhancement and method of producing a multi-row semiconductor package

UNITED TEST & ASSEMBLY CT LT

Thermally enhanced semiconductor package and method of producing the same

Semiconductor package with under bump metallization aligned with open vias

ST ASSEMBLY TEST SERVICE LTD

Ground plane for exposed package

ST ASSEMBLY TEST SERVICES LTD

Leadframe based chip scale package and method of producing the same

ST ASSEMBLY TEST SERVICES PTE

Ground plane for exposed package

TAN HIEN BOON

High density chip scale leadframe package and method of manufacturing the package

UNITED TEST AND ASSEMBLY TEST

Integrated circuit package with leadframe enhancement and method of manufacturing the same

UNITED TEST AND ASSEMBLY CENTER LTD

Method of producing a semiconductor package

RETUTA DANNY

Method of producing a semiconductor package

UTAC UNITED TEST AND ASSEMBLY

Semiconductor chip package and method of manufacture