Inventor

KIM GI JEONG

KR45 patents

⚠️ This page may combine multiple inventors who share the name “KIM GI JEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM GI JEONG

AMKOR TECHNOLOGY INC

Semiconductor device with increased I/O leadframe

Increased I/O leadframe and semiconductor device including same

Semiconductor device including leadframe having power bars and increased I/O

Leadframe for molded semiconductor package and semiconductor package made using the leadframe

Nonexposed heat sink for semiconductor package

Packaged electronic device having integrated antenna and locking structure

Semiconductor package having routable encapsulated conductive substrate and method

Leadframe type semiconductor package having reduced inductance and its manufacturing method

Land structure for semiconductor package and method therefor

Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure

Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe

Semiconductor package having routable encapsulated conductive substrate and method

Packaged electronic device having reduced parasitic effects and method

Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity

Electronic package structure having insulated substrate with lands and conductive patterns

Land structure for semiconductor package and method therefor

Method of forming a molded substrate electronic package and structure

Semiconductor device having single layer substrate and method

Electronic package structure with improved board level reliability

Method of forming a thin substrate chip scale package device and structure

Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure

Land structure for semiconductor package and method therefor

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor package having routable encapsulated conductive substrate and method

Land structure for semiconductor package and method therefor

Semiconductor devices and methods of manufacturing semiconductor devices

Packaged electronic device having integrated antenna and locking structure

Semiconductor package having routable encapsulated conductive substrate and method

Method of forming a molded substrate electronic package and structure

Land structure for semiconductor package and method therefor

Packaged electronic device having integrated antenna and locking structure

Electronic package structure with reduced vertical stress regions

Semiconductor devices with floating pad and their methods of manufacturing

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor devices and methods of manufacturing semiconductor devices

KIM GI JEONG

Semiconductor device including leadframe having power bars and increased I/O

Increased I/O leadframe and semiconductor device including same

Semiconductor device including leadframe with downsets

Semiconductor device with increased I/O leadframe

HANMI PHARM IND CO LTD

Clathrate of azithromycin hydrate with 1,2-propyleneglycol, method for the manufacture thereof and pharmaceutical composition comprising same

Process of preparing azithromycin and crystalline 9-deoxo-9a-aza-9a-homoerythromycin A hydrate used therein

HANMI PHARM CO

Method of preparing form II crystals of clarithromycin

KIM JAE YOON

Increased capacity semiconductor package

KIM JOON SU

Lead frame for semiconductor device

SAMSUNG ELECTRONICS CO LTD

Method and apparatus for generating packet in mobile communication system