Inventor

KIM BYONG JIN

KR65 patents

⚠️ This page may combine multiple inventors who share the name “KIM BYONG JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM BYONG JIN

AMKOR TECHNOLOGY INC

Method for fabricating semiconductor package and semiconductor package using the same

Packaged electronic device having integrated antenna and locking structure

Semiconductor package having routable encapsulated conductive substrate and method

Semiconductor package and manufacturing method thereof

Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening

Land structure for semiconductor package and method therefor

Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure

Semiconductor device including leadframe with a combination of leads and lands and method

Semiconductor device including leadframe with a combination of leads and lands and method

Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe

Semiconductor package having routable encapsulated conductive substrate and method

Method for fabricating semiconductor package and semiconductor package using the same

Method for fabricating semiconductor package and semiconductor package using the same

Semiconductor package and manufacturing method thereof

Packaged electronic device having reduced parasitic effects and method

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Micro lead frame structure having reinforcing portions and method

Packaged electronic device having stepped conductive structure and related methods

Electronic package structure having insulated substrate with lands and conductive patterns

Land structure for semiconductor package and method therefor

Semiconductor package and fabricating method thereof

Method of forming a molded substrate electronic package and structure

Semiconductor device including leadframe with a combination of leads and lands and method

Semiconductor device including leadframe with a combination of leads and lands and method

Semiconductor device having single layer substrate and method

Semiconductor package and method therefor

Semiconductor device having conductive pads with neck-down portions to prevent solder reflow

Lead frame package having discharge holes and method of manufacturing the same

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor device having EMI shielding structure and related methods

Semiconductor package having routable encapsulated conductive substrate and method

Semiconductor device and methods of manufacturing semiconductor devices

Semiconductor device having EMI shielding structure and related methods

Method for fabricating semiconductor package and semiconductor package using the same

Semiconductor devices and methods of manufacturing semiconductor devices

Land structure for semiconductor package and method therefor

Semiconductor device having EMI shielding structure and related methods

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor package having routable encapsulated conductive substrate and method

Packaged electronic device having integrated antenna and locking structure

Method of forming a molded substrate electronic package and structure

Land structure for semiconductor package and method therefor

Packaged electronic device having integrated antenna and locking structure

Method for fabricating semiconductor package and semiconductor package using the same

Semiconductor devices and methods of manufacturing semiconductor devices

BAE JAE MIN

Semiconductor device with increased I/O configuration

Semiconductor device including leadframe with a combination of leads and lands

LEE JAE UNG

Semiconductor device with micro electromechanical system die

HWANG CHAN HA

Package in package semiconductor device with film over wire