Inventor

BAE JAE MIN

KR30 patents

⚠️ This page may combine multiple inventors who share the name “BAE JAE MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAE JAE MIN

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing semiconductor devices

Land structure for semiconductor package and method therefor

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof

Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

Packaged electronic device having integrated antenna and locking structure

Semiconductor device and a method of manufacturing a semiconductor device

Land structure for semiconductor package and method therefor

Packaged electronic device having integrated antenna and locking structure

Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof

Semiconductor device and a method of manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor device and a method of manufacturing a semiconductor device

AMKOR TECHNOLOGY INC

Packaged electronic device having integrated antenna and locking structure

Land structure for semiconductor package and method therefor

Semiconductor device including leadframe with a combination of leads and lands and method

Semiconductor device including leadframe with a combination of leads and lands and method

Land structure for semiconductor package and method therefor

Semiconductor device including leadframe with a combination of leads and lands and method

Semiconductor device including leadframe with a combination of leads and lands and method

Semiconductor device having single layer substrate and method

Semiconductor package and method therefor

Semiconductor device and manufacturing method thereof

Semiconductor package and method therefor

Semiconductor device and manufacturing method thereof

Land structure for semiconductor package and method therefor

BAE JAE MIN

Semiconductor device with increased I/O configuration

Semiconductor device including leadframe with a combination of leads and lands