Inventor · disambiguated record
Chet V. Lenox
Also filed as: LENOX CHET V · LENOX CHET VERNON
13 granted patents·1 pending application·5 citations·filing 2013–2022
83Inventor score
Top patents by PatentIndex Score
14 records- 0193US11614480B2System and method for Z-PAT defect-guided statistical outlier detection of semiconductor reliability failuresKLA CORP·Filed 2021·Granted Mar 28, 2023·3 cites·29 claims
- 0269US8828833B1System for controlling SiGe-to-gate spacingTEXAS INSTRUMENTS INC·Filed 2013·Granted Sep 9, 2014·2 cites·10 claims
- 0356US11899065B2System and method to weight defects with co-located modeled faultsKLA CORP·Filed 2022·Granted Feb 13, 2024·0 cites·32 claims
- 0456US9768078B2Inner L-spacer for replacement gate flowTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 19, 2017·0 cites·16 claims
- 0556US9087917B2Inner L-spacer for replacement gate flowTEXAS INSTRUMENTS INC·Filed 2013·Granted Jul 21, 2015·0 cites·7 claims
- 0655US9362375B2Inner L-spacer for replacement gate flowTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 7, 2016·0 cites·6 claims
- 0754US9178037B2Inner L-spacer for replacement gate flowTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 3, 2015·0 cites·7 claims
- 0853US12422376B2Imaging reflectometry for inline screeningKLA CORP·Filed 2021·Granted Sep 23, 2025·0 cites·44 claims
- 0953US12332182B2System for automatic diagnostics and monitoring of semiconductor defect die screening performance through overlay of defect and electrical test dataKLA CORP·Filed 2022·Granted Jun 17, 2025·0 cites·42 claims
- 1051US11798827B2Systems and methods for semiconductor adaptive testing using inline defect part average testingKLA CORP·Filed 2021·Granted Oct 24, 2023·0 cites·25 claims
- 1151US11624775B2Systems and methods for semiconductor defect-guided burn-in and system level testsKLA CORP·Filed 2021·Granted Apr 11, 2023·0 cites·25 claims
- 1250US11754625B2System and method for identifying latent reliability defects in semiconductor devicesKLA CORP·Filed 2021·Granted Sep 12, 2023·0 cites·27 claims
- 1349US11656274B2Systems and methods for evaluating the reliability of semiconductor die packagesKLA CORP·Filed 2021·Granted May 23, 2023·0 cites·35 claims
- 1442US2022196723A1System and method for automatically identifying defect-based test coverage gaps in semiconductor devicesKLA CORP·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →