Inventor

EDELSTEIN DANIEL C

US271 patents

⚠️ This page may combine multiple inventors who share the name “EDELSTEIN DANIEL C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EDELSTEIN DANIEL C

IBM

Method for wafer-wafer bonding

Nitride-enriched oxide-to-oxide 3D wafer bonding

Interconnect with titanium—oxide diffusion barrier

Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications

Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications

Method of forming barrier layers for damascene interconnects

Serial intelligent electro-chemical-mechanical wafer processor

Dual etch stop/diffusion barrier for damascene interconnects

Interconnect structures with fully aligned vias

Chemical-mechanical planarization of barriers or liners for copper metallurgy

Method for preparing a conductive pad for electrical connection and conductive pad formed

Diamond-like carbon for use in VLSI and ULSI interconnect systems

Process for forming a damascene structure

Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing

Device and methodology for reducing effective dielectric constant in semiconductor devices

Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer

Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates

Post-fuse blow corrosion prevention structure for copper fuses

Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond

Method to plate C4 to copper stud

Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate

Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material

Adhesion of silicon carbide films

Formation of advanced interconnects

Self-forming embedded diffusion barriers

Substrate bonding with diffusion barrier structures

Chemical-mechanical planarization of metallurgy

Copper interconnect structure with manganese oxide barrier layer

Copper interconnect structure with manganese oxide barrier layer

Copper interconnect structure with manganese oxide barrier layer

Method of forming a copper based interconnect structure

Cobalt top layer advanced metallization for interconnects

Interconnect structure with barrier layer

Interconnect structure with capping layer and barrier layer

Large grain size conductive structure for narrow interconnect openings

Device and methodology for reducing effective dielectric constant in semiconductor devices

Air gap under on-chip passive device

Semiconductor structure for fuse and anti-fuse applications

Structure and method of chemically formed anchored metallic vias

Terminal pad structures and methods of fabricating same

Low-K dielectric material system for IC application

Liner with improved electromigration redundancy for damascene interconnects

Low-k dielectric material system for IC application

Post-fuse blow corrosion prevention structure for copper fuses

Increasing an electrical resistance of a resistor by oxidation or nitridization

EDELSTEIN DANIEL C

Reliable physical unclonable function for device authentication

Microelectronic structure including air gap

GLOBALFOUNDRIES INC

Substrate bonding with diffusion barrier structures

CORNELL RES FOUNDATION INC

Femtosecond ultraviolet laser using ultra-thin beta barium borate

YANG CHIH-CHAO

Metal cap with ultra-low k dielectric material for circuit interconnect applications