Inventor · disambiguated record
Hidetsugu Namiki
Also filed as: NAMIKI HIDETSUGU
30 granted patents·17 pending applications·178 citations·filing 1999–2024
95Inventor score
Top patents by PatentIndex Score
47 records- 0195US8232640B2Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic deviceTOMODA KATSUHIRO·Filed 2007·Granted Jul 31, 2012·40 cites·8 claims
- 0290US9994743B2Adhesive and light-emitting deviceDEXERIALS CORP·Filed 2014·Granted Jun 12, 2018·13 cites·20 claims
- 0389US8444882B2Anisotropic conductive film and light emitting deviceKANISAWA SHIYUKI·Filed 2010·Granted May 21, 2013·18 cites·12 claims
- 0488US8710662B2Light-reflective anisotropic conductive paste and light-emitting deviceUMAKOSHI HIDEAKI·Filed 2011·Granted Apr 29, 2014·12 cites·23 claims
- 0582US9670385B2Anisotropic conductive adhesiveDEXERIALS CORP·Filed 2015·Granted Jun 6, 2017·4 cites·19 claims
- 0682US8852462B2Light-reflective anisotropic conductive adhesive and light-emitting deviceUMAKOSHI HIDEAKI·Filed 2012·Granted Oct 7, 2014·7 cites·26 claims
- 0782US8758546B2Buffer film for multi-chip packagingISHIGAMI AKIRA·Filed 2011·Granted Jun 24, 2014·8 cites·5 claims
- 0876US9487678B2Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesiveDEXERIALS CORP·Filed 2015·Granted Nov 8, 2016·3 cites·6 claims
- 0976US2025031468A1Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structureDEXERIALS CORP·Filed 2024·Application pending·0 cites
- 1075US6355357B1Flexible printed board, polyamic acid and polyamic acid varnish containing sameSONY CHEMICALS CORP·Filed 1999·Granted Mar 12, 2002·26 cites·14 claims
- 1170US6346298B1Flexible boardSONY CHEMICALS CORP·Filed 1999·Granted Feb 12, 2002·31 cites·5 claims
- 1268US9676066B2Anisotropic conductive adhesiveDEXERIALS CORP·Filed 2013·Granted Jun 13, 2017·2 cites·5 claims
- 1367US9418958B2Anisotropic conductive adhesiveDEXERIALS CORP·Filed 2013·Granted Aug 16, 2016·2 cites·14 claims
- 1464US9548141B2Light-reflective anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2010·Granted Jan 17, 2017·2 cites·9 claims
- 1563US2025128361A1Solder particle manufacturing method, solder particle, and conductive compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1661US12142621B2Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structureDEXERIALS CORP·Filed 2020·Granted Nov 12, 2024·0 cites·25 claims
- 1760US2025001528A1Solder particles, solder particle production method, and conductive compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1859US2024367270A1Solder particles, method for producing solder particles, and conductive compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1957US8846142B2Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particleAKUTSU YASUSHI·Filed 2010·Granted Sep 30, 2014·0 cites·3 claims
- 2056US6717064B1Substrate piece and flexible substrateSONY CHEMICALS CORP·Filed 2000·Granted Apr 6, 2004·6 cites·6 claims
- 2156US2024266086A1Composite conductive particle and method for manufacturing composite conductive particleDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 2255US9260634B2Light-reflective anisotropic conductive adhesive agent, and light emitting deviceDEXERIALS CORP·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 2354US9340710B2Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting deviceDEXERIALS CORP·Filed 2013·Granted May 17, 2016·0 cites·6 claims
- 2454US8975654B2Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting deviceDEXERIALS CORP·Filed 2014·Granted Mar 10, 2015·0 cites·15 claims
- 2551US2014248477A1Buffer film for multi-chip packagingDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 2650US8309224B2Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particleAKUTSU YASUSHI·Filed 2008·Granted Nov 13, 2012·0 cites·7 claims
- 2750US2013264602A1Light-reflective anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2012·Application pending·0 cites
- 2849US10435601B2Adhesive agent and connection structureDEXERIALS CORP·Filed 2015·Granted Oct 8, 2019·0 cites·32 claims
- 2948US8916894B2Light-reflective anisotropic conductive adhesive agent, and light emitting deviceNAMIKI HIDETSUGU·Filed 2011·Granted Dec 23, 2014·0 cites·18 claims
- 3048US8636924B2Anisotropic conductive adhesiveNAMIKI HIDETSUGU·Filed 2009·Granted Jan 28, 2014·0 cites·11 claims
- 3148US2023015183A1Repairing component including micro-led chip and production method thereof, repairing method, method for producing light emitting device, and light emitting deviceDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 3247US12237096B2Connection structure, method of manufacturing connection structure, connection material, and coated conductive particleDEXERIALS CORP·Filed 2020·Granted Feb 25, 2025·0 cites·16 claims
- 3347US8796725B2Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2010·Granted Aug 5, 2014·0 cites·8 claims
- 3447US7647694B2Method for mounting electronic componentSONY CORP·Filed 2004·Granted Jan 19, 2010·4 cites·7 claims
- 3546US10174225B2Adhesive compositionDEXERIALS CORP·Filed 2016·Granted Jan 8, 2019·0 cites·11 claims
- 3646US9670384B2Light-reflective anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2012·Granted Jun 6, 2017·0 cites·18 claims
- 3744US8790547B2Anisotropic conductive adhesiveNAMIKI HIDETSUGU·Filed 2010·Granted Jul 29, 2014·0 cites·20 claims
- 3844US2015034989A1Anisotropic conductive adhesive and method for manufacturing same, light-emitting device and method for manufacturing sameDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 3944US2013105841A1Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting deviceNAMIKI HIDETSUGU·Filed 2011·Application pending·0 cites
- 4043US2014217450A1Anisotropic conductive adhesive and method for manufacturing same, and light-emitting device and method for manufacturing sameDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 4142US2015197672A1Anisotropic conductive adhesive and connection structureDEXERIALS CORP·Filed 2013·Application pending·0 cites
- 4238US10873016B2Light-emitting device and method for manufacturing the sameDEXERIALS CORP·Filed 2017·Granted Dec 22, 2020·0 cites·14 claims
- 4337US2013056686A1Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive filmNAMIKI HIDETSUGU·Filed 2011·Application pending·0 cites
- 4436US2019016930A1Adhesive compositionDEXERIALS CORP·Filed 2016·Application pending·0 cites
- 4535US2016204313A1Light-emitting device, anisotropic conductive paste, and method of manufacturing light-emitting deviceDEXERIALS CORP·Filed 2016·Application pending·0 cites
- 4633US2019244937A1Display device and method for manufacturing the same, and light-emitting device and method for manufacturing the sameDEXERIALS CORP·Filed 2017·Application pending·0 cites
- 4733US2012168814A1Adhesive compositionNAMIKI HIDETSUGU·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →