Buffer film for multi-chip packaging

Abstract

A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.

1 . A buffer film for multi-chip packaging, comprising a heat-resistant resin layer and a flexible resin layer formed thereon, wherein the heat-resistant resin layer has a linear expansion coefficient of 80 ppm/° C. or lower and the flexible resin layer is made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80. 
     
     
         2 . The buffer film for multi-chip packaging according to  claim 1 , wherein the heat-resistant resin layer is formed from a polyimide resin film, a polyester resin film, a polyvinyl chloride resin film, a polyolefin resin film, or a fluororesin film. 
     
     
         3 . The buffer film for multi-chip packaging according to  claim 1 , wherein the resin material forming the flexible resin layer is an anionically living-polymerizable silicone resin composition. 
     
     
         4 . The buffer film for multi-chip packaging according to  claim 1 , wherein the heat-resistant resin layer has a thickness of 200 μm or less and the flexible resin layer has a thickness of 10 μm or more.