Inventor · disambiguated record
Hideaki Umakoshi
Also filed as: UMAKOSHI HIDEAKI
14 granted patents·9 pending applications·32 citations·filing 2008–2020
87Inventor score
Top patents by PatentIndex Score
23 records- 0188US8710662B2Light-reflective anisotropic conductive paste and light-emitting deviceUMAKOSHI HIDEAKI·Filed 2011·Granted Apr 29, 2014·12 cites·23 claims
- 0282US8852462B2Light-reflective anisotropic conductive adhesive and light-emitting deviceUMAKOSHI HIDEAKI·Filed 2012·Granted Oct 7, 2014·7 cites·26 claims
- 0382US8758546B2Buffer film for multi-chip packagingISHIGAMI AKIRA·Filed 2011·Granted Jun 24, 2014·8 cites·5 claims
- 0476US9487678B2Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesiveDEXERIALS CORP·Filed 2015·Granted Nov 8, 2016·3 cites·6 claims
- 0564US9548141B2Light-reflective anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2010·Granted Jan 17, 2017·2 cites·9 claims
- 0656US10604600B2Photocurable resin composition and cured product of sameOSAKA SODA CO LTD·Filed 2017·Granted Mar 31, 2020·0 cites·6 claims
- 0755US9260634B2Light-reflective anisotropic conductive adhesive agent, and light emitting deviceDEXERIALS CORP·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 0854US9340710B2Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting deviceDEXERIALS CORP·Filed 2013·Granted May 17, 2016·0 cites·6 claims
- 0954US8975654B2Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting deviceDEXERIALS CORP·Filed 2014·Granted Mar 10, 2015·0 cites·15 claims
- 1054US2022135833A1Coating compositionOSAKA SODA CO LTD·Filed 2020·Application pending·0 cites
- 1153US2020407579A1Active energy ray-curable inkjet ink compositionOSAKA SODA CO LTD·Filed 2019·Application pending·0 cites
- 1251US9481804B2Electroconductive ink compositionDAISO CO LTD·Filed 2013·Granted Nov 1, 2016·0 cites·18 claims
- 1351US2014248477A1Buffer film for multi-chip packagingDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 1450US2013264602A1Light-reflective anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2012·Application pending·0 cites
- 1548US8916894B2Light-reflective anisotropic conductive adhesive agent, and light emitting deviceNAMIKI HIDETSUGU·Filed 2011·Granted Dec 23, 2014·0 cites·18 claims
- 1647US8796725B2Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2010·Granted Aug 5, 2014·0 cites·8 claims
- 1746US9670384B2Light-reflective anisotropic conductive adhesive and light-emitting deviceNAMIKI HIDETSUGU·Filed 2012·Granted Jun 6, 2017·0 cites·18 claims
- 1846US8415706B2Optical semiconductor package sealing resin materialUMAKOSHI HIDEAKI·Filed 2008·Granted Apr 9, 2013·0 cites·10 claims
- 1944US2015034989A1Anisotropic conductive adhesive and method for manufacturing same, light-emitting device and method for manufacturing sameDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 2044US2013105841A1Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting deviceNAMIKI HIDETSUGU·Filed 2011·Application pending·0 cites
- 2143US2014217450A1Anisotropic conductive adhesive and method for manufacturing same, and light-emitting device and method for manufacturing sameDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 2239US2018186064A1Composition for liningOSAKA SODA CO LTD·Filed 2016·Application pending·0 cites
- 2337US2013056686A1Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive filmNAMIKI HIDETSUGU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →