Inventor
LEE KEUNHYUK
CN25 patents
⚠️ This page may combine multiple inventors who share the name “LEE KEUNHYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
23 patentsUS10566713B2Feb 18, 2020
Press-fit power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC5 citations82
US11615967B2Mar 28, 2023
Power module package and method of manufacturing the same
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US12489080B2Dec 2, 2025
Flexible clip with aligner structure
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12266590B2Apr 1, 2025
Dual side direct cooling semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12074160B2Aug 27, 2024
Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11908826B2Feb 20, 2024
Flexible clip with aligner structure
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11004698B2May 11, 2021
Power module package
SEMICONDUCTOR COMPONENTS IND LLC1 citations62
US11222832B2Jan 11, 2022
Power semiconductor device package
SEMICONDUCTOR COMPONENTS IND LLC1 citations61
USD1113776SFeb 17, 2026
Power module package
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
USD1098055SOct 14, 2025
Power module package
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
USD1095474SSep 30, 2025
Power module package
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12300689B2May 13, 2025
Dual cool power module with stress buffer layer
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12211771B2Jan 28, 2025
Power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12119576B2Oct 15, 2024
Press-fit power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11658171B2May 23, 2023
Dual cool power module with stress buffer layer
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11652030B2May 16, 2023
Power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations60
US11315856B2Apr 26, 2022
Leadframe with sockets for solderless pins
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12593736B2Mar 31, 2026
Power module package with stacked direct bonded metal substrates
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US12354930B2Jul 8, 2025
Module with substrate recess for conductive-bonding component
SEMICONDUCTOR COMPONENTS IND LLC0 citations58
US11776871B2Oct 3, 2023
Module with substrate recess for conductive-bonding component
SEMICONDUCTOR COMPONENTS IND LLC0 citations58
US11127651B2Sep 21, 2021
High power module semiconductor package with multiple submodules
SEMICONDUCTOR COMPONENTS IND LLC0 citations56
US10553517B2Feb 4, 2020
High power module semiconductor package with multiple submodules
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US10804626B2Oct 13, 2020
Press-fit power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations50