USD1098055SActiveUtility

Power module package

Assignee: SEMICONDUCTOR COMPONENTS IND LLCPriority: Dec 2, 2022Filed: Dec 2, 2022Granted: Oct 14, 2025
Est. expiryDec 2, 2042(~16.4 yrs left)· nominal 20-yr term from priority
42
PatentIndex Score
0
Cited by
44
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a power module package, as shown and described.

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