Inventor · disambiguated record
Jerome Teysseyre
Also filed as: TEYSSEYRE JEROME
52 granted patents·18 pending applications·147 citations·filing 2003–2025
97Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC52ST MICROELECTRONICS PTE LTD7FAIRCHILD SEMICONDUCTOR4ST MICROELECTRONICS SA3TEYSSEYRE JEROME2
Top patents by PatentIndex Score
70 records- 0197US8664044B2Method of fabricating land grid array semiconductor packageJIN YONGGANG·Filed 2011·Granted Mar 4, 2014·97 cites·13 claims
- 0294US11075137B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 27, 2021·9 cites·21 claims
- 0393US11810775B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Nov 7, 2023·2 cites·18 claims
- 0491US11984424B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0590US11430777B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 30, 2022·2 cites·16 claims
- 0688US2025372467A1Sic mosfet semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0787US2025140659A1Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0886US10665525B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted May 26, 2020·6 cites·21 claims
- 0986US8860207B2Method of fabricating land grid array semiconductor packageST MICROELECTRONICS PTE LTD·Filed 2014·Granted Oct 14, 2014·7 cites·20 claims
- 1082US12417999B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 1182US12308364B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 1282US2025279405A1Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1381US11935817B2Power device module with dummy pad die layoutSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 19, 2024·1 cites·20 claims
- 1481US11621203B2SiC MOSFET semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Apr 4, 2023·2 cites·20 claims
- 1580US12142551B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 1678US12463103B2SiC MOSFET semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 1777US12489080B2Flexible clip with aligner structureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Dec 2, 2025·0 cites·23 claims
- 1877US11848320B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1977US11145571B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 12, 2021·2 cites·20 claims
- 2076US12293955B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 2175US11988743B2Molded proximity sensorST MICROELECTRONICS PTE LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 2275US2024429136A1Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2375US2025125297A1Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2474US11545421B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 2574US10319670B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·1 cites·18 claims
- 2674US2024413148A1Isolated 3d semiconductor device package with transistors attached to opposing sides of leadframe sharing leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2772US12266590B2Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 2872US11735508B2Vertical and horizontal circuit assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 2972US2024222231A1Power device module with dummy pad die layoutSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 3071US12205918B2Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 3170USD1095474SPower module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Granted Sep 30, 2025·0 cites·1 claims
- 3270US12230551B2Immersion direct cooling modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 18, 2025·0 cites·16 claims
- 3370US2025233050A1Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 3468US9254596B2Top gate mold with particle trapTEYSSEYRE JEROME·Filed 2011·Granted Feb 9, 2016·2 cites·18 claims
- 3567US12471204B2Semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 11, 2025·0 cites·21 claims
- 3667US11222832B2Power semiconductor device packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 11, 2022·1 cites·21 claims
- 3766US12074160B2Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 3866US11908826B2Flexible clip with aligner structureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·0 cites·22 claims
- 3966US2023230895A1Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 4065US10429509B2Molded proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Oct 1, 2019·1 cites·5 claims
- 4165US2025174515A1Methods of producing high power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 4263US11610832B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 21, 2023·0 cites·23 claims
- 4363US10910297B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 4463US2025149406A1Immersion direct cooling modules and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 4563US2022173022A1Clips for semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 4662US9059058B2Image sensor device with IR filter and related methodsST MICROELECTRONICS ASIA·Filed 2012·Granted Jun 16, 2015·1 cites·25 claims
- 4761US12087677B2Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 10, 2024·0 cites·13 claims
- 4861US9851328B2Compact microelectronic integrated gas sensorST MICROELECTRONICS PTE LTD·Filed 2014·Granted Dec 26, 2017·0 cites·19 claims
- 4961US2025300030A1Electronic power substrate for enhanced sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 5060US11513220B2Molded proximity sensorST MICROELECTRONICS PTE LTD·Filed 2019·Granted Nov 29, 2022·0 cites·20 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →